ficonTEC's Assembly Line for micro-assembly applications consists of very flexible and modular systems whose basic elements can be customized for the required assembly task. Typical applications include the automated assembly of photonic systems, laser diode modules, FTTx modules (PLC), DPSS lasers, micro-optical benches, fiber assemblies, medical devices, opto-electronic devices, MEMS, sensor and micro mechanics.
This innovative platform can be configured for the most demanding assembly applications. Both passive and active alignment routines can be performed with computer vision and the possibility of integrating all types of third party drivers, detectors and measurement instruments. The assembly accuracies are +/-5µm for passive and +/-2µm for active alignment. Multiple pickup tools and gripper types are available depending on the desired application and devices to be processed. Adhesive bonding (UV-curing), micro welding or soldering can be chosen as the preferred bonding technology. |
With its high–speed, linear motor-driven X-Y-Z-_-stage system, the AL2000 offers higher motion speeds, a larger working area and even better alignment accuracy (down to +/-1µm) than the AL1000. |