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Assembly Line

ficonTEC's Assembly Line for micro-assembly applications consists of very flexible and modular systems whose basic elements can be customized for the required assembly task. Typical applications include the automated assembly of photonic systems, laser diode modules, FTTx modules (PLC), DPSS lasers, micro-optical benches, fiber assemblies, medical devices, opto-electronic devices, MEMS, sensor and micro mechanics.

AL1000

ficonTEC's Assembly Line for micro-assembly applications consists of flexible and modular systems. The innovative platform can be configured for assembly applications - micro assembly

This innovative platform can be configured for the most demanding assembly applications within micro assembly. Both passive and active alignment routines can be performed with vision guided motion and the possibility of integrating different third party drivers, detectors and measurement instruments. The assembly accuracies are +/- 2,5µm for passive and in a submicron range for active alignment. Multiple pickup tools and gripper types are available depending on the desired application and devices to be processed. The micro assembly system can equipped (depending on the application as follows:

  • Flexible steel housing for differnt system sizes
  • Industrial Control System
  • State of the art motion controller 
  • Linear motor driven gantry system
  • High resolution Vision System
  • Automatic machine calibration
  • Dynamic Bond Head with Online Bond Force Control
  • SQL Database and interface to production database
  • Flexible process software with process sequencer
  • SMEMA interface
  • Conveyor
  • Wafer table with die Ejector
  • Wafer Changer
  • Dispenser system
  • Stamping System with Stamp changer
  • UV Curing Unit/Thermal Curing
  • Tip/Tilt Control (for bond line thicknes control)

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