Our Bond Line systems offer fully automated, unattended operation for the mounting of devices to heat sinks or submounts with an accuracy down to +/-1µm. Typical applications are soldering of laser diode bars using indium or AuSn solder. This product line also offers optional fully automated visual device inspection.
The ficonTEC BL1000 laser diode bar soldering system offers a cost-effective solution for soldering laser bars to heat sinks. The system features automated pick-up of laser bars and heat sinks or submounts from GelPaks and customized trays, fully automated 5-axis alignment of the laser bar to the heat sink or submount with an accuracy of +/-2µm, soldering temperature up to 400°C, online temperature monitoring, chip flip, adjustable bond force, OCR capability, formic gas generation as well as forming gas supply. |
The BL2000 is ficonTEC's automated high performance laser diode bar soldering system and offers a higher throughput than the BL1000. In addition to the features of the BL1000, the BL2000 offers 6-axis alignment of the laser bar with an accuracy of +/-1µm and the ability to be equipped with a fully automated visual device inspection. Inspection of the P-side, N-side and the facets is available. |