Projects, Initiatives & Associations
As part of the on-going development of our technology base, and also as part of our contribution into the development of the sector, ficonTEC is pleased to have previously been, and be currently actively involved and associated with numerous international projects and initiatives.
A national PIC manufacturing infrastructure,
widely accessible and inherently flexible
AIM Photonics (American Institute for Manufacturing Integrated Photonics) is an industry-driven public-private partnership that focuses the US’s premiere capabilities and expertise to capture critical global manufacturing leadership in photonics.
The Institute’s goal is to emulate the dramatic successes experienced by the electronics industry over the past 40 years and to transition key lessons, processes, and approaches to the photonic integrated circuit (PIC) industry. In doing so, AIM Photonics aims to support SMEs, providing practical access and technology on-ramps for US industry, government, and academic communities.
ficonTEC is closely following this initiative and ficonTEC US has already been selected among a list of suppliers. Our first contribution comes through the award of a contract for a new wafer-level automated tester, working in close cooperation with UoC (University of Columbia), SUNY (State University of New York), and RTI (Rochester Technical Institute).
The world’s first open-access
Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line
Consisting of a highly-interdisciplinary team of Europe’s leading industrial & research organizations, PIXAPP’s goal is to is help exploit the breakthrough advantages of PIC technologies by providing users with single-point access to PIC assembly and packaging.
In avoiding what is probably the most significant bottleneck in developing competitive photonic devices, the challenge is to create accepted design rules and standards for photonics packaging, including automatization of the processes and of mass-scale testing, so as to reduce the overall cost of PIC-based products.
The PIXAPP initiative covers five main aspects: design, materials, devices, applications, and equipment. ficonTEC’s role within the project is to target improvements and innovations of existing and future photonics assembly and testing equipment.