ficonTEC Newsletter

Q2 2025 – OFC 50 in San Francisco THIS WEEK

Contents:

1. Events: ficonTEC at OFC 50 in San Francisco, CA/USA
2. Wafer-level PIC Test System for Semiconductor ATE
3. Collaboration with Femtum
4. Further Events

ficonTEC at OFC 50 San francisco, CA/USA, April 1-3

2025 will see a number of significant developments from ficonTEC, both intrinsically and (importantly) in collaboration with market and innovation leaders in the combined electronic/photonic integrated circuit (EIC/PIC) space (aka silicon photonics).

OFC 50, this year taking place in the Moscone Center in San Francisco and celebrating 50 years of optical networking and communications, marks the first of many of the associated announcements – see below for further details.

You can find us at booth #5401 in the Concourse Area between the main halls - we look forward to sharing our news!

Wafer-level PIC Test System for Semiconductor ATE

Following extensive discussion and development with major semiconductor ATE manufacturers, specifically in the context of combined electro-optical PIC test at volume in a fab environment, ficonTEC is pleased to reveal an innovative 300 mm double-sided electro-optical wafer tester compatible with existing ATE. This is targeted at the silicon photonics manufacturing sector, in particular at AI-driven CPO destined for data center applications.

This new optical test cell directly docks with the ATE at a core software and hardware level, enabling DC and high-data-rate test capability on the top side and precision optical six-axis active alignment probing below. It also accommodates automatic wafer loading and incorporates a patented vacuum thermal control chuck assembly, in-situ fiber array calibration, end-face inspection, high-speed probe calibration, and automated PIC mapping.

Find out more about the functionality and compatibility in the press release.

Collaboration with Femtum

Femtum, based out of Québec, Canada, is a manufacturer of highly-capable mid-infrared lasers. By utilizing ficonTEC’s class-leading precision wafer-level alignment and probing capability, Femtum is actively pursuing EIC and PIC cleaning and trimming applications that promise to help optimize yield during the ubiquitous wafer testing procedure.

Femtum will be presenting these technologies at OFC 50 – visit booth #4441 (right next to ficonTEC’s own booth).

Come along to both booths, take in the demo, and speak to experts of both companies for more details.

Further Events

ficonTEC will be bringing a string of further announcements during 2025, primarily (but not only) in the field of combined EIC/PIC silicon photonics applications and manufacturing thereof. Expect to be able to find out more at the following events:

+ PIC International in Brussels, Belgium.
+ Photonics Finland in Oulu, Finland.
+ The Integrated Photonics Area at Laser World of Photonics in Munich in June.

… and at other events in the ficonTEC calendar.

You can also always follow us on LinkedIN and automatically remain up-to-date on the latest news and developments.

ficonTEC Service GmbH
Rehland 8, 28832 Achim, Germany

marketing@ficontec.com

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