{"id":14912,"date":"2023-11-21T16:01:35","date_gmt":"2023-11-21T15:01:35","guid":{"rendered":"https:\/\/www.ficontec.com\/?p=14912"},"modified":"2024-11-07T11:07:13","modified_gmt":"2024-11-07T10:07:13","slug":"mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update","status":"publish","type":"post","link":"https:\/\/www.ficontec.com\/cn\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/","title":{"rendered":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update"},"content":{"rendered":"[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

October 2023<\/span><\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”]\n

Mass manufacturing of transceivers for the terabit\/s era \u2013 an update<\/h2>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”yes” pb_border_bottom=”no” width=”2\/3″ el_position=”first”]\n

The MASSTART project<\/a> is pursued by a consortium of renown European organizations and coordinated by the Fraunhofer IZM institute. It has been running since January 2019.
\nThe integration of silicon photonics components within photonic devices still relies on legacy production technologies. This inherent issue of limited throughput and the associated high cost is unsurprisingly a major hurdle to the introduction of new photonic developments into the consumer market, and one that can only be solved by cost-efficient assembly solutions. To this end, since 2019 ficonTEC has been developing concepts and assembly solutions for the automated mass production of photonic devices. A key aspect is the concatenation of different assembly stations into a single integrated production line with automated part handling. Orchestrating the whole via a higher-ranking process control will achieve the required high throughput.<\/p>\n[\/spb_text_block] [spb_single_image image=”14913″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_self” caption=”ficonTEC project manager Simon Kibben explaining the assembly strategy” width=”1\/3″ el_position=”last”] [spb_single_image image=”14922″ image_size=”full” frame=”noframe” intro_animation=”none” full_width=”no” lightbox=”no” link_target=”_self” caption=”Final review meeting in the laboratory” width=”1\/3″ el_position=”first”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

On September 26-27, 2023, the Final Project Review Meeting of MASSTART took place at ficonTEC in Achim. We took great pleasure in hosting project partners<\/a> \u2013 from Leti, BRIGHT Photonics, Adtran, NVIDIA, Almae Technologies, Teem Photonics, Fraunhofer IZM and Aristotelio Panepistimio Thessaloniki \u2013 and discussing the latest findings and outcomes of the CWDM and coherent transceiver module assemblies.
\nA clear path to a fully automated production line for transceiver assembly was demonstrated \u2013 implementing mostly passive assembly steps and reducing the cycle time of the overall transceiver assembly \u2013 to our partners, the project reviewers, and the EU project officer. The results achieved, the lessons learned as well as the first implementation of project results into new mass production lines currently in development will allow us to better the performance of our product range for all high-throughput applications.<\/p>\n[\/spb_text_block] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\nMore info about MASSTART<\/span><\/a>\n[\/spb_text_block] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [boxed_content type=”whitestroke” custom_bg_colour=”#F0F0F0″ custom_text_colour=”#333333″ pb_margin_bottom=”no” width=”1\/1″ el_position=”first last”]\n

\n

 <\/p>\n

<\/a>
\nExternal Vimeo link –\u00a0 privacy<\/a><\/p>\n<\/div>\n

\n

MASSTART \u2013 High-throughput Assembly for Transceivers: An Update
\nContributions from Fraunhofer IZM, NVIDIA & ficonTEC<\/h3>\n

To improve the eco-system for the mass production of photonic devices, the EU-funded\u00a0MASSTART project<\/a>\u00a0set out in 2019 to explore cost-efficient assembly solutions that address the needs of the device manufacturers. In a joint webinar hosted by ficonTEC, project coordinator\u00a0Fraunhofer IZM<\/a>\u00a0and device manufacturer\u00a0NVIDIA<\/a>\u00a0discuss their roles, goals and wish lists for next-generation transceiver manufacturing and how these are addressed within MASSTART.
\n<\/div>

<\/div>\n[\/boxed_content]\n","protected":false},"excerpt":{"rendered":"

[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] October 2023 [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”] Mass manufacturing of transceivers for the terabit\/s era \u2013 an update [\/spb_text_block] [spb_text_block pb_margin_bottom=”yes” pb_border_bottom=”no” width=”2\/3″ el_position=”first”] The MASSTART project is pursued by a consortium of renown European organizations and coordinated by the Fraunhofer IZM institute. It has been running […]<\/p>\n","protected":false},"author":1,"featured_media":14919,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[32,65,64],"tags":[129,75,76,73,77,72,232,71,233,234],"class_list":["post-14912","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-blog","category-partner-references","category-projects-initiatives","tag-assembly","tag-custom","tag-eu","tag-fraunhofer","tag-horizon2020","tag-hybrid-integration","tag-passive","tag-rd","tag-transceiver","tag-update"],"yoast_head":"\nMass manufacturing of transceivers for the terabit\/s era \u2013 an update - ficonTEC<\/title>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update - ficonTEC\" \/>\n<meta property=\"og:description\" content=\"[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] October 2023 [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”] Mass manufacturing of transceivers for the terabit\/s era \u2013 an update [\/spb_text_block] [spb_text_block pb_margin_bottom=”yes” pb_border_bottom=”no” width=”2\/3″ el_position=”first”] The MASSTART project is pursued by a consortium of renown European organizations and coordinated by the Fraunhofer IZM institute. It has been running […]\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/\" \/>\n<meta property=\"og:site_name\" content=\"ficonTEC\" \/>\n<meta property=\"article:published_time\" content=\"2023-11-21T15:01:35+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2024-11-07T10:07:13+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg\" \/>\n\t<meta property=\"og:image:width\" content=\"1170\" \/>\n\t<meta property=\"og:image:height\" content=\"650\" \/>\n\t<meta property=\"og:image:type\" content=\"image\/jpeg\" \/>\n<meta name=\"author\" content=\"ficonadmin\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:creator\" content=\"@ficontec\" \/>\n<meta name=\"twitter:site\" content=\"@ficontec\" \/>\n<meta name=\"twitter:label1\" content=\"Written by\" \/>\n\t<meta name=\"twitter:data1\" content=\"ficonadmin\" \/>\n\t<meta name=\"twitter:label2\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data2\" content=\"3 minutes\" \/>\n<script type=\"application\/ld+json\" class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/\"},\"author\":{\"name\":\"ficonadmin\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#\\\/schema\\\/person\\\/33c100d5ddbf622208c0564f17f75769\"},\"headline\":\"Mass manufacturing of transceivers for the terabit\\\/s era \u2013 an update\",\"datePublished\":\"2023-11-21T15:01:35+00:00\",\"dateModified\":\"2024-11-07T10:07:13+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/\"},\"wordCount\":622,\"publisher\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#organization\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2023\\\/11\\\/masstart-kibben-2.jpg\",\"keywords\":[\"assembly\",\"custom\",\"EU\",\"Fraunhofer\",\"Horizon2020\",\"hybrid integration\",\"passive\",\"R&D\",\"transceiver\",\"update\"],\"articleSection\":[\"Blog\",\"Partner & References\",\"Projects & Initiatives\"],\"inLanguage\":\"zn-CN\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/\",\"url\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/\",\"name\":\"Mass manufacturing of transceivers for the terabit\\\/s era \u2013 an update - ficonTEC\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2023\\\/11\\\/masstart-kibben-2.jpg\",\"datePublished\":\"2023-11-21T15:01:35+00:00\",\"dateModified\":\"2024-11-07T10:07:13+00:00\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#breadcrumb\"},\"inLanguage\":\"zn-CN\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"zn-CN\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#primaryimage\",\"url\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2023\\\/11\\\/masstart-kibben-2.jpg\",\"contentUrl\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2023\\\/11\\\/masstart-kibben-2.jpg\",\"width\":1170,\"height\":650},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"Startseite\",\"item\":\"https:\\\/\\\/www.ficontec.com\\\/cn\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Mass manufacturing of transceivers for the terabit\\\/s era \u2013 an update\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#website\",\"url\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/\",\"name\":\"ficonTEC\",\"description\":\"photonics assembly & testing\",\"publisher\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#organization\"},\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"zn-CN\"},{\"@type\":\"Organization\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#organization\",\"name\":\"ficonTEC Service GmbH\",\"url\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/\",\"logo\":{\"@type\":\"ImageObject\",\"inLanguage\":\"zn-CN\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#\\\/schema\\\/logo\\\/image\\\/\",\"url\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2018\\\/01\\\/logo-last.jpg\",\"contentUrl\":\"https:\\\/\\\/www.ficontec.com\\\/wp-content\\\/uploads\\\/2018\\\/01\\\/logo-last.jpg\",\"width\":1170,\"height\":650,\"caption\":\"ficonTEC Service GmbH\"},\"image\":{\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#\\\/schema\\\/logo\\\/image\\\/\"},\"sameAs\":[\"https:\\\/\\\/x.com\\\/ficontec\",\"https:\\\/\\\/www.linkedin.com\\\/company\\\/ficontec\\\/\"]},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/www.ficontec.com\\\/jp\\\/#\\\/schema\\\/person\\\/33c100d5ddbf622208c0564f17f75769\",\"name\":\"ficonadmin\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update - ficonTEC","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/","og_locale":"en_US","og_type":"article","og_title":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update - ficonTEC","og_description":"[blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] October 2023 [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”first last”] Mass manufacturing of transceivers for the terabit\/s era \u2013 an update [\/spb_text_block] [spb_text_block pb_margin_bottom=”yes” pb_border_bottom=”no” width=”2\/3″ el_position=”first”] The MASSTART project is pursued by a consortium of renown European organizations and coordinated by the Fraunhofer IZM institute. It has been running […]","og_url":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/","og_site_name":"ficonTEC","article_published_time":"2023-11-21T15:01:35+00:00","article_modified_time":"2024-11-07T10:07:13+00:00","og_image":[{"width":1170,"height":650,"url":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg","type":"image\/jpeg"}],"author":"ficonadmin","twitter_card":"summary_large_image","twitter_creator":"@ficontec","twitter_site":"@ficontec","twitter_misc":{"Written by":"ficonadmin","Est. reading time":"3 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#article","isPartOf":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/"},"author":{"name":"ficonadmin","@id":"https:\/\/www.ficontec.com\/jp\/#\/schema\/person\/33c100d5ddbf622208c0564f17f75769"},"headline":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update","datePublished":"2023-11-21T15:01:35+00:00","dateModified":"2024-11-07T10:07:13+00:00","mainEntityOfPage":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/"},"wordCount":622,"publisher":{"@id":"https:\/\/www.ficontec.com\/jp\/#organization"},"image":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#primaryimage"},"thumbnailUrl":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg","keywords":["assembly","custom","EU","Fraunhofer","Horizon2020","hybrid integration","passive","R&D","transceiver","update"],"articleSection":["Blog","Partner & References","Projects & Initiatives"],"inLanguage":"zn-CN"},{"@type":"WebPage","@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/","url":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/","name":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update - ficonTEC","isPartOf":{"@id":"https:\/\/www.ficontec.com\/jp\/#website"},"primaryImageOfPage":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#primaryimage"},"image":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#primaryimage"},"thumbnailUrl":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg","datePublished":"2023-11-21T15:01:35+00:00","dateModified":"2024-11-07T10:07:13+00:00","breadcrumb":{"@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#breadcrumb"},"inLanguage":"zn-CN","potentialAction":[{"@type":"ReadAction","target":["https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/"]}]},{"@type":"ImageObject","inLanguage":"zn-CN","@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#primaryimage","url":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg","contentUrl":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2023\/11\/masstart-kibben-2.jpg","width":1170,"height":650},{"@type":"BreadcrumbList","@id":"https:\/\/www.ficontec.com\/mass-manufacturing-of-transceivers-for-the-terabit-s-era-an-update\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"Startseite","item":"https:\/\/www.ficontec.com\/cn\/"},{"@type":"ListItem","position":2,"name":"Mass manufacturing of transceivers for the terabit\/s era \u2013 an update"}]},{"@type":"WebSite","@id":"https:\/\/www.ficontec.com\/jp\/#website","url":"https:\/\/www.ficontec.com\/jp\/","name":"ficonTEC","description":"photonics assembly & testing","publisher":{"@id":"https:\/\/www.ficontec.com\/jp\/#organization"},"potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/www.ficontec.com\/jp\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"zn-CN"},{"@type":"Organization","@id":"https:\/\/www.ficontec.com\/jp\/#organization","name":"ficonTEC Service GmbH","url":"https:\/\/www.ficontec.com\/jp\/","logo":{"@type":"ImageObject","inLanguage":"zn-CN","@id":"https:\/\/www.ficontec.com\/jp\/#\/schema\/logo\/image\/","url":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2018\/01\/logo-last.jpg","contentUrl":"https:\/\/www.ficontec.com\/wp-content\/uploads\/2018\/01\/logo-last.jpg","width":1170,"height":650,"caption":"ficonTEC Service GmbH"},"image":{"@id":"https:\/\/www.ficontec.com\/jp\/#\/schema\/logo\/image\/"},"sameAs":["https:\/\/x.com\/ficontec","https:\/\/www.linkedin.com\/company\/ficontec\/"]},{"@type":"Person","@id":"https:\/\/www.ficontec.com\/jp\/#\/schema\/person\/33c100d5ddbf622208c0564f17f75769","name":"ficonadmin"}]}},"_links":{"self":[{"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/posts\/14912","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/users\/1"}],"replies":[{"embeddable":true,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/comments?post=14912"}],"version-history":[{"count":14,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/posts\/14912\/revisions"}],"predecessor-version":[{"id":15794,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/posts\/14912\/revisions\/15794"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/media\/14919"}],"wp:attachment":[{"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/media?parent=14912"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/categories?post=14912"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/www.ficontec.com\/cn\/wp-json\/wp\/v2\/tags?post=14912"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}