{"id":8653,"date":"2020-11-11T12:23:16","date_gmt":"2020-11-11T11:23:16","guid":{"rendered":"https:\/\/www.ficontec.com\/?page_id=8653"},"modified":"2024-07-04T15:26:16","modified_gmt":"2024-07-04T13:26:16","slug":"webinar","status":"publish","type":"page","link":"https:\/\/www.ficontec.com\/jp\/webinar\/","title":{"rendered":"ficonTEC\u00a0Webinar Mini-Series"},"content":{"rendered":"[blank_spacer height=”30px” spacer_id=”first-webinar” spacer_name=”First webinar” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n

ficonTEC Webinar Series<\/h2>\n

Our popular mini-webinar series was an effective remote visual information tool used to stay in touch with interested followers during the pandemic in 2020 and 2021.<\/h3>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”]\n

The series comprised bite-sized webinars on a full spectrum of topics covering product developments, technologies & capabilities, important and trending topics, ML-based process control, etc., critical aspects of HVM as well as other themes. Each was rounded off with an open Q&A session.<\/p>\n

All webinars are available retrospectively via view-on-demand below.<\/p>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/2″ el_position=”first”]\n

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Dec. 1 – Sub-\u00b5m Through-Silicon Alignment<\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/2″ el_position=”last”]\n

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Oct. 6 – Fiber Preparation Concept: An Update<\/h4>\n[\/spb_text_block] [blank_spacer height=”30px” spacer_id=”first-webinar” spacer_name=”First webinar” width=”1\/1″ el_position=”first last”] [\/spb_column] [blank_spacer height=”30px” spacer_id=”upcoming” spacer_name=”Upcoming Webinars” width=”1\/1″ el_position=”first last”] [spb_row wrap_type=”content-width” row_bg_type=”image” color_row_height=”content-height” bg_image=”5578″ bg_type=”cover” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ row_padding_vertical=”50″ row_padding_horizontal=”0″ row_margin_vertical=”0″ remove_element_spacing=”no” inner_column_height=”col-natural” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”]\n

Published Webinars<\/h2>\n

All webinars are now feely available without registration.<\/p>\n[\/spb_text_block] [blank_spacer height=”30px” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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December 12, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

EPIC CEO Award 2021 goes to Torsten Vahrenkamp
\nInterview at ficonTEC with Jos\u00e9 Pozo, EPIC CTO<\/h3>\n

EPIC has announced the winner of the EPIC CEO Award 2021 as\u00a0Torsten Vahrenkamp<\/a>, CEO and co-founder of\u00a0ficonTEC Service GmbH<\/a>\u00a0together with\u00a0Matthias Trinker<\/a>\u00a0(CFO)\u00a0roughly 20 years ago. And in the conversation between Jos\u00e9 and Torsten we have the promised replacement for the webinar originally planned for the end of 2021. Enjoy!<\/p>\n[\/spb_text_block] [\/spb_column] [spb_column width=”1\/1″ el_position=”first last”] [blank_spacer height=”0px” spacer_id=”through-silicon” spacer_name=”Through-silicon” width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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December 01, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

Sub-\u00b5m Through-silicon Alignment & Assembly with IR
\nChristoph Mittelstaedt, ficonTEC R&D<\/h3>\n

Through-silicon machine vision takes advantage of the optical transparency of silicon beyond ~1.1\u00b5m. Given the right approach, light sources can be passively coupled directly into waveguides by viewing from beneath the wafer \u2013 and with results equal to those for active alignment. We present these results and discuss some specific applications that should benefit the most.<\/p>\n

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October 06, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

Fiber Preparation Concepts: An Update
\nDr. Erik Beckert<\/a>\u00a0from\u00a0Fraunhofer IOF<\/a>\u00a0and\u00a0Arne Bentfeldt<\/a>, Senior Product Manager at ficonTEC<\/h3>\n

Based on work undertaken within the now successfully completed\u00a0LasClad project<\/a>, we \u2013 that is, together with Erik Beckert from Fraunhofer IOF \u00a0\u2013 now want to present a closer look at the Fiber Preparation system ideas already teased in a previous webinar \u2013 tested concepts, intended capabilities and relevant application spaces.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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September 29, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

PIC Testing with Wafer-level Test Systems
\nwith I\u00f1igo Artundo<\/a>, CEO of VLC Photonics,<\/a> Prof. Andrea Melloni of Politecnico di<\/a> Milano <\/a>and Torsten Vahrenkamp<\/a> CEO of ficonTEC<\/a><\/h3>\n
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With an ever increasing number of wafer-level test systems spread across production, delivery, installation and being operational, some customers are already gaining useful insights into its application. With the first Season 3 webinar, I\u00f1igo Artundo and now Prof. Andrea Melloni of Politecnico di Milano join Torsten Vahrenkamp for an in-depth view of VLC Photonics\u2019 own approach to the utilization and potential of this tool.<\/div>\n<\/div>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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June 02, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

LIGENTEC ACADEMY Webinar #2 – PIC Testing
\nMichael Kelly (Keysight Technologies) + Torsten Vahrenkamp (ficonTEC) + Antoine Brimont (LIGENTEC)<\/h3>\n

View Torsten Vahrenkamp\u2019s own, as well as the other speaker contributions to the\u00a0Ligentec Academy webinar on PIC Testing<\/a>.\u00a0This webinar contribution should be particularly interesting to those wanting to learn more about ficonTEC\u2019s integrated photonic test system developments (see also our own webinar on this topic below).<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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April 28, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

High-volume In-line Manufacturing
\nDr. Gregory Flinn, Augusto Mandelli & Frank Baumann (CEO, Duramentum)<\/h3>\n

While our stand-alone systems were always in-line-capable, it was the introduction<\/a> of our \u2018made for in-line\u2019 platform in 2018 that really took this to the next level. Our current \u2018king of in-line\u2019 is a 14 system production line<\/a> for automotive sensor applications. For those seeking in-line production capability, this webinar will cover what you need to know.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [blank_spacer height=”0px” spacer_id=”wafer-level-test-update” spacer_name=”wafer-level-test-update” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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April 14, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

Wafer-level Test Development Update
\nDr. Gregory Flinn + Torsten Vahrenkamp (CEO, ficonTEC)<\/h3>\n

The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the\u00a0first concept systems delivered in 2019<\/a>, this first of 3 WLT variants now commonly provides combined electro-optical test for R&D development and low-volume, low-complexity test-&-qualify tasks. However, on the very near-horizon are variants 2 and 3, for batch testing of VCSELs and test-&-qualify of high-complexity integrated devices (think: co-packaging), respectively. Join CEO Torsten Vahrenkamp for an update on what ficonTEC is bringing to the photonics test-&-measurement eco-system.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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March 17, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

MASSTART \u2013 High-throughput Assembly for Transceivers: An Update
\nContributions from Fraunhofer IZM, NVIDIA & ficonTEC<\/h3>\n

To improve the eco-system for the mass production of photonic devices, the EU-funded\u00a0MASSTART project<\/a>\u00a0set out in 2019 to explore cost-efficient assembly solutions that address the needs of the device manufacturers. In a joint webinar hosted by ficonTEC, project coordinator\u00a0Fraunhofer IZM<\/a>\u00a0and device manufacturer\u00a0NVIDIA<\/a>\u00a0discuss their roles, goals and wish lists for next-generation transceiver manufacturing and how these are addressed within MASSTART.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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February 10, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

F300 & CL1500 for Fiber Assembly
\nDr. Gregory Flinn + Arne Bentfeldt<\/h3>\n

In a return to looking at\u00a0ficonTEC\u2019s products<\/a>, we look at two very important, popular and flexible systems in our fiber assembly line-up, the\u00a0F300<\/a>\u00a0and the\u00a0CL1500<\/a>. Both systems have at least\u00a0been\u00a0mentioned before in previous webinars, but here we discuss and contrast the breadth of application for which each system can be applied. We also tease an exciting, fully automated fiber strip, cleave and insert development system by revealing and describing\u00a0a demo video<\/a>\u00a0for the concept.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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January 20, 2021 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

ficonTEC \u2013 Webinar #01 – Kick-off\u00a0 Webinar 2021
\nDr. Gregory Flinn + Torsten Vahrenkamp (CEO, ficonTEC)<\/h3>\n

In this 2nd kick-off webinar\u00a0with CEO Torsten Vahrenkamp, this time for the 2021 webinar series,\u00a0we look back to review 2020, discuss our international plans, the latest technology developments for PIC testing and high-volume manufacturing, and round-up by sharing our expectations for 2021.<\/p>\n[\/spb_text_block] [\/spb_column] [\/spb_row] [spb_row wrap_type=”full-width” row_bg_type=”color” row_bg_color=”#f5f5f5″ color_row_height=”content-height” bg_type=”cover” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ row_padding_vertical=”0″ row_padding_horizontal=”0″ row_margin_vertical=”0″ remove_element_spacing=”no” inner_column_height=”col-natural” width=”1\/1″ el_position=”first last”] [fullwidth_text alt_background=”none” width=”1\/1″ el_position=”first last”]\n

2020 webinars
\n<\/span><\/h4>\n[\/fullwidth_text] [\/spb_row] [spb_row wrap_type=”content-width” row_bg_type=”color” row_bg_color=”#ffffff” color_row_height=”content-height” bg_image=”5578″ bg_type=”cover” parallax_image_height=”content-height” parallax_image_movement=”fixed” parallax_image_speed=”0.5″ parallax_video_height=”window-height” parallax_video_overlay=”none” row_overlay_opacity=”0″ row_padding_vertical=”50″ row_padding_horizontal=”0″ row_margin_vertical=”0″ remove_element_spacing=”no” inner_column_height=”col-natural” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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December 16, 2020 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

Automated Assembly for Lidar
\nDr. Gregory Flinn + Torsten Vahrenkamp, CEO<\/h3>\n
LiDAR is a strongly trending topic currently, with market research indicating hyper-growth over the next few years \u2013 and not just in automotive. With several technology approaches for both the light projection and image capture side of the device, naturally there is great opportunity for implementation of photonic assembly and testing.<\/div>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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November 25, 2020 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

BondLine \/ CustomLine – Stand-alone & In-line Systems
\nDr. Gregory Flinn + Andreas Ott<\/h3>\n

A rundown of our fully automated, high-precision\u00a0position-&-attach\u00a0bonder product lines<\/a> for photonic-enabled chips and dies. We compare and contrast the technologies and capabilities each product line can provide, and give some insights as to their usage.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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November 04, 2020 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

Passive vs. Active Alignment – What you need to know!
\nDr. Gregory Flinn & Dr. Simon Kibben<\/h3>\n

Depending on the requirements of the application, there are arguments both for and against<\/a> the use of (only) passive or passive\/active alignment approaches. We will try to shed some light on the differences in methodology, requirements and results, and hopefully banish any urban myths.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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October 28, 2020 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

AssemblyLine \/ FiberLine – Stand-alone & In-line Systems
\nDr. Gregory Flinn<\/h3>\n

A rundown of our fully automated, high-precision,\u00a0fast-active\u00a0align-&-attach\u00a0assembly<\/a> product lines for (integrated) photonic components and opto-electronic devices. We overview the technologies and capabilities they can provide, and give some insights as to their usage.<\/p>\n[\/spb_text_block] [\/spb_column] [divider type=”thin” text=”Go to top” full_width=”no” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/3″ el_position=”first”]\n

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October 21, 2020 – Freely viewable<\/span><\/h4>\n[\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”2\/3″ el_position=”last”]\n

ficonTEC \u2013 Webinar #01 – Photonics Assembly & Test \u2013 ‘ficonTEC 101’
\nDr. Gregory Flinn + Torsten Vahrenkamp (CEO, ficonTEC)<\/h3>\n

In this kick-off webinar\u00a0with CEO Torsten Vahrenkamp,\u00a0we provide an introduction to the series, what you can expect in future episodes, as well as an overview of ficonTEC as a company, as a machine systems manufacturer, as a solutions provider for all thing #photonics_assembly_and_test, and,\u00a0last but not least, we briefly discuss trending topics.<\/p>\n[\/spb_text_block] [\/spb_column] [\/spb_row]\n","protected":false},"excerpt":{"rendered":"

[blank_spacer height=”30px” spacer_id=”first-webinar” spacer_name=”First webinar” width=”1\/1″ el_position=”first last”] [spb_column width=”1\/1″ el_position=”first last”] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”3\/4″ el_position=”first last”] ficonTEC Webinar Series Our popular mini-webinar series was an effective remote visual information tool used to stay in touch with interested followers during the pandemic in 2020 and 2021. [\/spb_text_block] [spb_text_block pb_margin_bottom=”no” pb_border_bottom=”no” width=”1\/1″ el_position=”first last”] The series comprised bite-sized webinars on […]<\/p>\n","protected":false},"author":1,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-8653","page","type-page","status-publish","hentry"],"yoast_head":"\nficonTEC Webinars \u2013 ficonTEC Service<\/title>\n<meta name=\"description\" content=\"ficonTEC Webinars \u2013 As an extension of our ficonTEC Insider Blog channel, we will be hosting a pilot webinar series.ficonTEC webinars \u2013 Our popular mini-webinar series from 2020 and 2021.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/www.ficontec.com\/webinar\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"ficonTEC Webinars \u2013 ficonTEC Service\" \/>\n<meta property=\"og:description\" content=\"ficonTEC Webinars \u2013 As an extension of our ficonTEC Insider Blog channel, we will be hosting a pilot webinar series.ficonTEC webinars \u2013 Our popular mini-webinar series from 2020 and 2021.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/www.ficontec.com\/webinar\/\" \/>\n<meta property=\"og:site_name\" content=\"ficonTEC\" \/>\n<meta property=\"article:modified_time\" content=\"2024-07-04T13:26:16+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/www.ficontec.com\/wp-content\/uploads\/2021\/11\/webinar-season3-silicon.jpg\" \/>\n<meta name=\"twitter:card\" content=\"summary_large_image\" \/>\n<meta name=\"twitter:site\" content=\"@ficontec\" \/>\n<meta name=\"twitter:label1\" content=\"Est. reading time\" \/>\n\t<meta name=\"twitter:data1\" content=\"11 minutes\" \/>\n<script type=\"application\/ld+json\" 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