ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are realized as cutting-edge, semi- or fully-automated production systems, regardless of the device material and of the specific application the device is targeting. Our modular system architecture is additionally scalable, so that exploratory, proof-of-process assembly as well as high-volume assembly and test requirements are addressable – and anything in between.
A globally installed base of over 700 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more. Not resting with the status quo, ficonTEC is continually and actively involved in several internationally-supported initiatives. These initiatives promote access to integrated photonics technology through the current transition to high-volume manufacturing processes via advanced automation – regardless of whether for singulated dies or for wafer-level approaches.