June 03, 2020
One of the remaining frontiers in #photonics_assembly_and_test is mixed-signal electro-optical testing for high-volume applications. Neither electrical nor optical individually present a major hurdle to developing processes (either singly or at wafer level), but as soon as the two are mixed, and then also ‘on-wafer’, there are suddenly a number of issues.
Firstly, mixed-signal probe heads need to cater to the different contact scales and device geometries. Secondly, there are for some tests different time scales involved in signal acquisition, thirdly there are scalability issues associated with the concept of parallel testing approaches (think ‘channel density’ & ‘instrumentation’), and fourthly the differing requirements regarding validation vs. verification – the list probably goes on much longer, but that is a good start.
At ficonTEC we started diverting more resources to explore these issues in 2019. Ignazio has now recently moved to a full-time role assessing the eco-system requirements for testing VCSELs, PICs and other hybrid devices at wafer-level. He also gave a (albeit) very brief illustration of developments at a recent online technical meeting organized by EPIC.
If you would like to find out more about the possibilities, please get in touch directly with Ignazio Piacentini.Contact us