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Choose taskdie-level assembly & testfiber-level assembly & testwafer-level assembly & testcustom assemblylaser chip stacking/unstackinglaser weldingnot specified
Choose primary (select 1 – use 'Secondary' & 'Additional Notes' to add detail)micro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microwelding
Choose secondarymicro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microweldingnot specifiednone
Choose targetsensors/lidarcommunicationsquantum technologyhealthcareimage captureaerospace/spaceprintmacro/industrialmixed/variousnot specifiednone
Choose workflowR&Dprototypingproduct developmentprocess developmentbatch manufacturinghigh-volume, in-linenot specifiednone
Choose deadlineQ1/2025Q2/2025Q3/2025Q4/2025Q1/2026not specifiednone
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Data Privacy:
All request submissions and registrations are naturally subject to our comprehensive and GDPR-conform Privacy Policy. By clicking the "Send request" button, you are agreeing to being appropriately and reasonably contacted for the purposes of answering your request, and (if additionally selected) for receipt of our Newsletter and for topic dissemination, scheduling and participation for ficonTEC’s Webinar Series.
