A Modular Approach to Machines
Over 600 machines delivered globally, from standard off-the-shelf
to highly-customized, highly-automated solutions
Since 2001, and now with over 600 systems in the field, ficonTEC is the market leader when it comes to off-the-shelf and individually customized solutions for automated micro-assembly, packaging and testing of photonics-based components, micro-optic assemblies and opto-electronic devices.
Our machines employ established and industry-recognized assembly technologies – micro-positioning, active/passive precision alignment, attachment via welding, soldering and/or bonding, and optical inspection. ficonTEC also provides a suite of test capabilities for individual components and assembled hybrid opto-electronic devices. Moreover, with everything being controlled by our flexible process control software, the product platforms described below become so much more than just the sum of their parts.
The technologies available to ficonTEC and implemented in both the stand-alone and newer in-line machine solutions translate into a broad and established spectrum of production process capability. We are continually refining capability, modularity and design so that these systems reliably and cost-effectively meet strict efficiency and yield requirements even for cutting-edge production processes.
For the team here at ficonTEC, these tasks are already simply everyday challenges.
Systems that bridge the gap from R&D proof-of-process to complex,
high-volume and even multi-line production
Traditionally our most popular machine format, ficonTEC’s stand-alone machines are designed to provide as much multi-functional, multi-step assembly, bonding or testing capability as possible in a single cell format. With world-class performance, comprehensive customization options, and exceptional reliability, these machines are best suited to complex production requirements requiring multiple process steps within a single machine system (stand-alone).
The stand-alone systems currently utilize machine housing formats 500, 1000, 1500, 2000-series and up – the higher the number, the greater the available workspace and resulting layout and modular flexibility. All are feed-system-capable, and different feed philosophies can be implemented to best suit the exact application.
Availability: Classified according to their primary function, machine type availability includes ASSEMBLYLINE, FIBERLINE, BONDLINE, CUSTOMLINE, TESTLINE, INSPECTIONLINE, STACKLINE and WELDLINE systems.
Suitable for R&D development all the way through to volume manufacturing. Additional special purpose cells and robotic systems can be flexibly designed and incorporated to suite customer requirements. See individual product lines below for more feature details.
ficonTEC’s next-generation machine systems utilize a newly-designed housing format and state-of-the-art feed-in/out capabilities in order to be in-line-capable from the ground up. These machines primarily address increasing customer demand for greater versatility together with higher volume requirements for photonic device production.
Initially, new ASSEMBLYLINE machine systems, are available in specific in-line configurations for production line applications. In addition, the new housing format has been designed to be compatible with other ficonTEC assembly and production machine types (as currently available in ficonTEC’s stand-alone machine systems), so the in-line product portfolio can be readily and flexibly expanded to suit individual customer production needs.
The in-line systems utilize newer machine housing formats: 400, 800, 1200, 1600-series and up – the higher the number, the greater the available workspace and resulting layout flexibility.
Availability: Classified according to their primary function, the in-line machines are currently available as ASSEMBLYLINE systems – other functional types available on request. They can be supplied either individually as a versatile production cell designed to slot into an existing or proposed production line, or as task-optimized machine segments comprising several different systems. In principal, even entire production lines can be envisaged, encompassing the full suite of processes required for photonics assembly, packaging and test.
Suitable for in-line applications all the way up to high-volume manufacturing as well as for multiple production line set-ups operating in parallel and in synch. Additional special purpose cells and robotic systems can be flexibly designed and incorporated to suite customer requirements. Please enquire for more details.
Entry-level systems & desk-top units
Many of the ‘modular’ technologies and capabilities developed and employed in our more complex machines are also available in a straightforward, single-function desk-top format (x100). The cost-of-ownership is low, and the customizable options are limited.
Availability: BONDLINE These units are primarily intended for laboratory use, R&D, proof-of-concept manufacturing, and other low-complexity applications.
For more complex, but still budget-conscious tasks, x300-series entry-level machines are designed to provide results representative of the more highly-specified stand-alone machines. A small number of optional modules are available for this series, thus enabling limited multi-functionality.
Availability: ASSEMBLYLINE. Typical use includes low-volume, semi- or fully-automatic high-accuracy assembly of opto-electronic and fiber-optic components, for example in micro-optical packages or onto PICs or other chip substrates.
Just some of the machine types that form either complete,
or just part of the photonics production solutions provided by ficonTEC
Automated Micro-Optics Assembly – ASSEMBLYLINE
High-precision, fast active alignment assembly solutions for micro-optical device assembly and attach tasks. ASSEMBLYLINE machines utilize our AUTOALIGN multi-axis positioning systems – high-end stages with multiple (from 3 up to 16) degrees-of-freedom combined with state-of-the-art real-time motion controllers, guaranteeing easy and accurate sub-µm pivot-point positioning.
Optional modules provide additional features (multi-functionality), with the high-end models providing optional automatic tool changing, optional test modules, and wafer processing capability.
Availability: Stand-alone from AL500 and up. In-line from A400 and up. 300-series entry-level systems are also available.
Automated Fiber-Optics Assembly – FIBERLINE
High-precision, fast active alignment assembly solutions specifically for fiber-optic and waveguide-based devices, including arrays. FIBERLINE machines utilize our AUTOALIGN multi-axis positioning systems – high-end stages with multiple (from 3 up to 12) degrees-of-freedom combined with state-of-the-art real-time motion controllers, guaranteeing easy and accurate sub-µm pivot-point positioning and alignment.
The F300 base unit can be customized with a suite of optional modules, providing additional functionality.
Availability: F300-series entry-level system only, but customizable with a range of optional modules providing additional functionality. Automatic FIBERLINE handling functionality is available in additional machine formats on request.FL300
Automated Die Bonding – BONDLINE
Precision, passive alignment assembly cells focused on chip/die alignment and associated thermal bonding processes, with accuracies down to the micron and even sub-micron range. Feature-rich functional modules provide thermal management, multiple bond force modes and eutectic/epoxy/soldering capability, thus catering to a wide range of individual bonding requirements. BONDLINE machines are designed for chip-on-submount (CoS), MEMS/MOEMS and sensor assembly, as well as for additional optical components such as photodiodes, LEDs, laser diodes and hybrid assemblies on silicon photonics and other PIC devices.
Available as semi-automated desktop modules (R&D, low-volume) and as fully-automated multi-functional stand-alone systems. High-end models provide optional automatic tool changing and wafer processing capability.
Availability: Stand-alone from BL500 and up. In-line from B400 and up. 100 & 300-series entry-level systems are also available.BL100 BL300 BL500
Adaptable Die Bonding Platform – CUSTOMLINE
Our most adaptable and versatile die bonder, the CUSTOMLINE machines (previously known as COMPACT) are a range of modular, multi-purpose die bonder cells. Sporting the largest range of optional modules available to any ficonTEC platform, these machines are designed to provide diverse ‘off-the-shelf’ pre-configurable solutions for customers in the semiconductor and photonics assembly and packaging sector.
Currently available as stand-alone systems, with larger machines providing optional automatic tool changing and wafer processing capability. Designed for industrial production environments, and especially suited to NPI (New Product Introduction).
Availability: Stand-alone from CL1000 and up.CL2000
Fully-automated Testing – TESTLINE
Fully-automated test systems for full LIV testing as well as spectral and near-/far-field beam characterization of single laser chips, VCSELs, unmounted laser diode bars, and chip-on-submount (CoS) sources. Also available for a variety of other complex tasks, including singulated chip testing, wafer-level testing, automated optical inspection, and more. High-end models can be equipped with an optional wafer table for wafer processing tasks.
Availability: Stand-alone from TL500 and up. In-line formats form part of product roadmap.TL2000
Fully-automated Inspection – INSPECTIONLINE
Fully-automated, multi-camera-based systems available for a variety of complex inspection tasks, achieved by acquiring high-resolution pictures of all surfaces of interest, and performing optical inspection based on the user’s criteria. Available with side, top and bottom wall inspection modules, as well as for coated facets of semiconductor chips and PICs. Wafer table option available. Different feeding philosophies are optionally available.
Availability: Stand-alone as IL2000. In-line formats form part of product roadmap.IL2000
Laser Diode Bar Stacking – STACKLINE
A unique machine providing fully-automated stacking and unstacking of laser diode bars. It can handle any combination of laser bars and spacers (dummies), generating flush or staggered stacks. It can optionally be equipped with fully-automated visual device inspection for sorting bars into the designated GelPaks or WafflePaks based on the inspection results.
Availability: Stand-alone as SL2000. In-line formats form part of product roadmap.More info
Laser Welding – WELDLINE
A 2- or 3-beam vertical configuration laser welding machine cell utilizing a fiber-coupled Nd:YAG laser and featuring automatic alignment, laser welding, device characterization and testing capabilities as well as sophisticated component tracking throughout the entire machine process. As standard the system includes ficonTEC‘s exclusive AccuView target viewing laser processing heads.
Availability: Currently stand-alone only.More info