Photonic Device Assembly
Assembling the photonic engines
that enable other industry sectors to move forward
Although the lion’s share of photonic device assembly is still for discrete components and devices, the recent developments in photonics integration illustrate well the ensuing dramatic evolution of the photonics market. In transitioning from the use of bulky to micro-optical components to integrated optics, the photonics sector is experiencing what became true for the electronics market some four decades ago.
Irrespective of component size, the assembly of photonic devices still fundamentally depends upon precision positioning and alignment. Additionally, a high-precision and thermally-capable bonding approach is key to the absolute performance and long-term reliability of the assembled component, as it directly affects lifetime (via heat dissipation) as well as operation and performance (via component temperature or residual stress). And by properly accounting for shrinkage during bond cooling or curing, maximum performance can be assured, thus maximizing yield.
As the component density of optical modules and their complexity increases – a vital trend necessary to ensure the future competitiveness of photonic solutions – the need for automation in assembly becomes increasingly obvious. And in particular when hybrid integration with semiconductor electronics is required – where electronics manufacture is already a highly automated technology – automation of photonic device assembly is the only real way forward.
The photonic devices our machines assemble include silicon photonics components, sensor assemblies, medical devices, MEMS/MOEMS, miniature lasers, hybrid assemblies, LED print heads, high-power LEDs, and many more.
Passive/active high-precision alignment
High-precision bonding accuracy
Hybrid integration, fiber alignment & pigtailing
Lens assembly into packages
Simultaneous alignment of two optical elements
Pick-&-place & handling sub-systems
Die sorting and component tracking
Welding, soldering, or epoxy bonding
Electronically adjustable bond force in mg range
Process parameter sequencing & tracking
Acquisition of operating parameters into a database
OCR for serial number tracking and component traceability