Photonic Device Testing

Photonic Device Testing

Testing and characterizing photonic devices
to suit the needs of the application

ficonTEC’s series of photonic device testing machines is focused on automated optical and electrical characterization of opto-electronic chips and assembles. These increasingly complex and miniaturized photonic devices and integrated circuits (PICs) perform advanced optical functions, such as routing, (de)multiplexing switching of optical signals, sensing and data communications. These devices include silicon photonics components, sensor assemblies, medical devices, MEMS/MOEMS, miniature lasers, hybrid assemblies, LED print heads, high-power LEDs, and many more.

The system checks to see if full opto-electronic functionality is meeting specifications. The accumulated data is written to an SQL database, providing the user with the necessary statistical analysis and feedback so that, for example, yield can be tracked and improved. The system allows full component tracking and sorting when equipped with a handling system.




The latest integrated designs, which incorporate both electronic and photonic devices on a hybrid device, provide benefit in terms of functionality, miniaturization, high-volume manufacture and cost/part. Furthermore, the long-term trend towards the uptake of PICs is a key driver for future manufacturing.

However, these high-volume manufactured devices also present a number of challenges during device testing. The long-term requirement will be for ever higher levels of automation and highly parallel, mixed-signal electro-optical testing concepts, both on and off-wafer – a goal to which ficonTEC is already working toward.

Key Features

  • Testing of singulated devices

  • Wafer-level testing

  • Testing of fully packaged devices

  • Combined optical & electrical testing

  • Interfacing to test & measurement equipment

  • Fully-automated processes


Device testing


Fully-automated testing


LIV testing and beam characterization

  • Vacuum pick-up tool handling

  • LIV, spectral and far & near-field tests

  • Easy-to-change optical & electrical probe heads

  • Die sorting and component tracking

  • Process parameter tracking

  • OCR for serial number tracking & component traceability

  • Flexible integration of external instrumentation and test protocols

  • Compatible to SQL and other database systems for data traceability

More information

Relevant systems include those from the TESTLINE
(some test capability is also available in ASSEMBLYLINE  products)



Wafer-level Test System, e.g. TL2000


(Automated) Fiber-Optics Assembly, incl. F300


Automated Electro-optical Wafer-level Tester