ficonTEC Webinar Series
Originally conceived as an extension to our ficonTEC Insider Blog channel,
we will now be continuing with our successful webinar series through 2021.
The series comprises a number of bite-sized webinars on a full spectrum of topics covering the product lines, technologies & capabilities, important and trending topics, ML-based process control, etc., critical aspects of HVM as well as other themes. We try to keep these short (and so that you can get back to work). We round up each with a Q&A session (open-ended), where participants are free to ask questions.
Previous webinars (available via view-on-demand), dates for future webinars and upcoming topics are freely visible (and grouped) below. Those interested in accessing all previous and future webinars are invited to register for free (and once only) for the full series (below).
Kick-off webinar Q4 2020 – interview with CEO Torsten Vahrenkamp
Kick-off webinar 2021 – review 2020 & outlook 2021
Each webinar will be recorded and will be viewable ‘on demand’ post-broadcast for all registered participants, thus enabling one to catch up on missed episodes, or on ‘the story so far’ for those registering later. Reminders and links will be sent in advance of each webinar, together with a brief synopsis of what will be discussed within that seminar. (N.B.: ficonTEC reserves the right to change and re-schedule the program to suit any needs and requirements, both internal and external).
The following topics will be held on the given dates:
MASSTART – High-throughput Assembly for Transceivers: An Update
Contributions from Fraunhofer IZM, NVIDIA & ficonTEC
To improve the eco-system for the mass production of photonic devices, the EU-funded MASSTART project set out in 2019 to explore cost-efficient assembly solutions that address the needs of the device manufacturers. In a joint webinar hosted by ficonTEC, project coordinator Fraunhofer IZM and device manufacturer NVIDIA discuss their roles, goals and wish lists for next-generation transceiver manufacturing and how these are addressed within MASSTART.
Wafer-level Test Development Update
Dr. Gregory Flinn + Torsten Vahrenkamp (CEO, ficonTEC)
The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the first concept systems delivered in 2019, this first of 3 WLT variants now commonly provides combined electro-optical test for R&D development and low-volume, low-complexity test-&-qualify tasks. However, on the very near-horizon are variants 2 and 3, for batch testing of VCSELs and test-&-qualify of high-complexity integrated devices (think: co-packaging), respectively. Join CEO Torsten Vahrenkamp for an update on what ficonTEC is bringing to the photonics test-&-measurement eco-system.
High-volume In-line Manufacturing
Dr. Gregory Flinn + Frank Baumann (CEO, Duramentum)
While our stand-alone systems were always in-line-capable, it was the introduction of our ‘made for in-line’ platform in 2018 that really took this to the next level. Our current ‘king of in-line’ is a 14 system production line for automotive sensor applications. For those seeking in-line production capability, this webinar will cover what you need to know.
Automated Assembly for Quantum Technology
Dr. Gregory Flinn + Guest
Quantum Technology is the current trend on everyone’s near horizon, with implications for computational simulation/prediction, alternative approaches to problem solving, security technology and much more. Not all that is quantum is photonics, but certainly enough for the community to have placed this high on the agenda. So, where does this field tangent photonics assembly & test? Join us for an overview of what you need to know.
20 Years of ficonTEC
Dr. Gregory Flinn + Guest
This webinar was going to include a preview of LWoP Munich, but we all now know that that event is no longer going to happen. The entire focus now falls solely to an overview of ficonTEC past, present and future. To conclude our webinar series for the first half of 2020, we look at 20 years of photonics assembly & test and summarize the near-term developments that you can expect.
Automated Assembly for Lidar
Dr. Gregory Flinn + Torsten Vahrenkamp, CEO
BondLine / CustomLine
Stand-alone & In-line Systems / Dr. Gregory Flinn + Andreas Ott
A rundown of our fully automated, high-precision position-&-attach bonder product lines for photonic-enabled chips and dies. We compare and contrast the technologies and capabilities each product line can provide, and give some insights as to their usage.
AI/ML-based Process Control
Dr. Gregory Flinn + Dr. Colin Dankwart + Dave Pritts
AI/ML-enabled applications in manufacturing are in the news, and rightly so. However, while already a cornerstone of Industry 4.0, there is still some way to go for their implementation in the photonics sector. We overview the application of this technology at ficonTEC and what this means for the customer.
Passive vs. Active Alignment
What you need to know! / Dr. Gregory Flinn & Dr. Simon Kibben
Depending on the requirements of the application, there are arguments both for and against the use of (only) passive or passive/active alignment approaches. We will try to shed some light on the differences in methodology, requirements and results, and hopefully banish any urban myths.
AssemblyLine / FiberLine
Stand-alone & In-line Systems / Dr. Gregory Flinn
A rundown of our fully automated, high-precision, fast-active align-&-attach assembly product lines for (integrated) photonic components and opto-electronic devices. We overview the technologies and capabilities they can provide, and give some insights as to their usage.