Photonics automated assembly and testing

From Lab to Fab

Photonics automated assembly and testing
From Lab to Fab

Cutting-edge assembly and testing machines serving requirements
in R&D and all the way through to high-volume production

ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are cutting-edge and are independent of the device material and of the specific application the device is targeting. Additionally, our modular system architecture is scalable from early device development environments, over new product introduction (NPI) and all the way up to high-volume requirements.

A globally installed base of over 600 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more.

Not resting with the status quo, ficonTEC is continually and actively involved in several internationally-supported initiatives. These initiatives promote access to integrated photonics technology through the transition to high-volume manufacturing processes via advanced automation, regardless of whether for singulated dies or for wafer-level approaches.


Solutions & Capabilities

Automated high-precision micro-assembly and testing of
photonic and opto-electronic components and sub-systems

Welcome to ficonTEC


Lens array alignment & attach


Dual-fiber alignment


Flip-chip assembly


Transceiver free-optics alignment


NPI (New Product Introduction)



Entry-level & Desk-top


Stand-alone systems


In-line systems


Our Vision

By actively engaging in international photonics integration initiatives,
we stay ahead of current technologies and fulfil the requirements of industry



Assembly, packaging and testing remain the highest cost factors in photonic integrated circuit (PIC) production. To address this issue, international collaborations around the globe are actively researching new manufacturing concepts for PIC technology. The goal of these projects is to provide industry with the production processes and the standards that will enable manufacturing to progress from the 1000s to the 100s of thousands and millions, from single chip assembly to wafer-level approaches, and where cost/part – not initial capital outlay – is the measure for equipment amortization.

ficonTEC has consistently retained a unique modular approach to its machine equipment design. Flexible and scalable options already enable customized assembly, packaging and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – both for contract manufacturing and for in-house R&D and production.



Photonic integrated circuits (PICs)


Photonic device assembly


High-volume applications


Technology horizons



What is photonics assembly and testing?

Photonic devices enable light to be used in manufacturing,
for sensing and for communications. How are these devices assembled?




The alignment and bonding (assembly) of opto-electronic components, free-beam optics and/or fiber-optic pigtails into finished photonic devices is commonly referred to as photonics packaging. Typical devices include telecom/datacom transceivers and TOSA/ROSA, stacked laser diode bars and high-power multi-emitter assemblies, micro-optics, optofluidic systems, camera modules, fiber-coupled devices, photonics-based sensors, automotive LIDAR, and much more.

Automating the assembly process steps requires multi-axis, sub-micron-accuracy component alignment (passive/active) and subsequent bonding using epoxy compounds, laser-induced soldering and/or laser welding. In particular, in adhering to standard manufacturing practices, all assembly steps need to be compliant with stringent requirements for yield, process repeatability and performance reliability, while still enabling minimal process cycle time.




Devices also require testing. Testing encompasses burn-in, LIV tests, characterization, validation, verification and mass production ‘go’ / ’no go’ testing from early prototyping (with multi-project wafers, MPW) to mass market production. It is required for simple devices such as laser diode chips and VCSELs, all the way up to complex photonics transceivers, compact camera modules (CCM), sensors, and other opto-electronics.

Why ‘From Lab to Fab’? An increasingly important aspect in manufacturing is the current trend singulated chips toward in-line and even full wafer-level approaches. This transition for photonics component manufacturing is much as was the case for the integrated micro-electronics industry in the 1970’s.

Currently, system approaches and materials R&D initiatives still require flexible, automation-capable, multi-functional micro-assembly machines for low-volume testing of device concepts and packaging approaches. However, the growing in-line, and the proposed wafer-level manufacturing and testing schemes for high-volume ‘fab-type’ photonics applications require development of highly-automated packaging and assembly equipment.



Requirements for process automation of optical interconnect technologies

The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres – Woodhead Publishing 2016.

Chapter 14 “Requirements for process automation of optical interconnect technologies” is written by Ignazio Piacentini (Director of Business Development) and Torsten Vahrenkamp, CEO – ficonTEC Germany.

Read chapter







Recent News & Upcoming Events

ficonTEC company news and product developments in the press,
and where to find us at events around the globe




May 20 – 23, 2019
Austin, Texas
NI Pavilion



May 28 – 31, 2019
Las Vegas, USA
Booth 315

Laser Munich

June 24 – 27, 2019
Munich, Germany
Booth 341, hall B2

Collaborative partnership

ficonTEC WLT Demo-Unit

Electro-optical testing
for integrated photonics

Mass manufacturing


New photonic developments
into the consumer market

Tyndall & ficonTEC


National Photonics
Manufacturing Pilot Line