Photonics Automated Assembly & Testing
From Lab to Fab
Cutting-edge assembly and testing machines serving requirements in R&D and all the way through to high-volume production
Welcome to ficonTEC
NPI (New Product Introduction)
Machine system production
Projects & Initiatives – PIXAPP
ficonTEC provides device micro-assembly and testing solutions for the photonics industry. These solutions are realized as cutting-edge, high-precision production systems utilizing advanced automation approaches, regardless of the device material and target application. Our modular system architecture is additionally scalable, so that exploratory, proof-of-process development as well as high-volume manufacturing requirements are addressable – and anything in between.
A globally installed base of 800 systems is already serving integrated photonics applications in telecom and datacom sectors, for 5G infrastructur, in 3D sensing for smartphone, automotive and aerospace applications, in high-power diode laser assembly, and in many others. ficonTEC is also actively involved in current international initiatives that are designed to reduce time-to-market for integrated photonics technology all within the current transition to high-volume manufacturing processes.
Discover Brilliant Solutions
The full gamut of process capability captured within a suite of innovative machine systems, all controlled by an advanced software interface
Suitable for R&D, process development, complex stand-alone, as well as high-volume, multi-line in-line production
Flexible and scalable options already enable customized assembly and testing solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – both for contract manufacturing and for in-house R&D & production.
Functional machine types designed to provide class-leading flexibility, performance and yield in photonic device production
ASSEMBLYLINE – Photonic Device Assembly
Fully automated, high-precision align-&-attach for (integrated) photonic and opto-electronic devices. Stand-alone and in-line. They uniquely combine fast-active alignment and flexible epoxy-based attachment configurations with a tried and tested software control interface.Learn more
BONDLINE – Precision Die Bonding
Fully automated, precision die bonder cells focused on high-resolution passive positioning for photonic-enabled chips & dies, coupled with thermal attachment (position-&-attach. Accuracies down to the micron and even sub-micron range. Feature-rich functional modules provide thermal management, multiple bond force modes and eutectic/epoxy/soldering attachment capability.Learn more
CUSTOMLINE – Flexible Micro-assembly Platform
Our most adaptable and versatile multi-purpose micro-assembly platform, providing fully automated align-&-attach for (integrated) opto-electronic and photonic devices. These systems are designed to provide highly flexible and individual solutions for a broad range of tasks in a wide range of industrial production environments.Learn more
TESTLINE – Electro-optical Device Testing
Fully automated test-&-qualify systems providing electrical, optical and mixed-signal electro-optical chip and device testing – on or off-wafer – for laser chips, bars (stacks) and VCSELs. Full LIV testing as well as spectral and near/far-field beam characterization of single laser chips, VCSELs, unmounted laser diode bars, and chip-on-submount (CoS) sources. Also available for a variety of other complex tasks, including singulated chip testing, automated optical inspection, and more.Learn more
Your Vision Expressed Via Our Process Capabilities
Our production systems embody the customer process,
described via a suite of our cutting-edge production capabilities
With 800 systems installed worldwide for diverse applications, only ficonTEC offers sufficient the breadth and depth of expertise
Assembly and testing remain the highest cost factors in photonic integrated circuit (PIC) production. To address this issue, international collaborations around the globe are actively researching new manufacturing concepts for PIC technology. The goal of these projects is to provide industry with an eco-system that will enable manufacturing to progress from the 1000s to the 100,000s and even millions, from single chip assembly to wafer-level approaches.
ficonTEC has consistently retained involvement in these initiatives in order to stay ahead of industry requirement. Add to this 20 years of development, continually working closely with the customer, and an invaluable modular approach to machine equipment design – all this uniquely places ficonTEC in a position to thoroughly describe your production requirements in terms of established process capabilities.
Challenge our applications development and process automation teams with your innovative products!
Technologies for production video
What Is Photonics Assembly And Testing?
Photonic devices harness light as a tool for many important societal applications, including healthcare and communications. How are these devices assembled?
The alignment and bonding of opto-electronic chips and components, free-beam micro-optics and/or fiber-optic connections into finished photonic devices is commonly referred to as photonics assembly & test (some simply refer to this as packaging). Typical devices include telecom/datacom transceivers (TOSA/ROSA/BOSA), infrastructure devices for 5G networks, photonics-based (3D) sensors including those used in commercial, automotive and aerospace (LiDAR) systems, integrated PICs, high-power multi-emitter laser assemblies, micro-optical and optofluidic systems, integrated camera modules, fiber-coupled devices, and much more. Advanced automation of the assembly process steps requires multi-axis, sub-micron-accuracy component alignment (passive/active) and subsequent bonding using (UV-) epoxy compounds, thermal-based or laser-induced soldering and/or laser welding.
In particular, all manufacturing steps need to be compliant with stringent and often bespoke requirements for yield, process repeatability and performance reliability, while still enabling minimal process cycle time and minimum downtime. Finished devices also need testing and is required for simple devices such as laser diode chips and VCSELs, all the way up to the more complex devices noted above. Testing encompasses burn-in, LIV tests, beam and spectral characterization, as well as device design validation and performance verification.
Recent News & Upcoming Events
ficonTEC blog entries, company news and product developments,
and where to find us at events around the globe
Convergence in device manufacturing
ficonTEC systems are already LiDAR and co-packaged-optics-ready.
Automated Strip, Cleave & Insert
For anyone needing to connectorize fiber ribbon, watch this.
Photonics West 2021 News
ficonTEC eco-system to be shown at Photonics West 2021
System Visibility Online
Most relationships strictly bound by NDAs, but systems are visible online.
Collaboration with Fraunhofer
Our connection with the Fraunhofer network of research institutes.
Tyndall National Institute
ficonTEC’s collaboration with Tyndall operates on several levels.
EPIC Online Technology Meetings
Here is just one of our options for maintaining lead acquisition.
Performance Services open up your pathway to lower TCO.
Providing Access To Technology
Applications Labs provide access to ficonTEC’s extensive process capability.
Mixed-signal testing for volume applications raises a number of issues.
ficonTEC implements recommendations to help combat Covid-19
ficonTEC delivers CL1500 for Micro- and Nanoelectronics in Europe
Developing direct flexprint technology for cost-effective integration
Machine Learning for Advanced Manufacturing
New Corporate Vice President at ficonTEC
ficonTEC and Coherent Solutions have entered into a collaborative partnership
MASSTART – Mass manufacturing of transceivers for the Terabit/s era
Manufacturing Pilot Line
InPulse – Indium-Phosphide Pilot Line