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Photonics automated assembly and testing

From Lab to Fab

Photonics Automated Assembly & Testing
From Lab to Fab

Cutting-edge assembly and testing machines serving requirements in R&D and all the way through to high-volume production


Welcome to ficonTEC

NPI (New Product Introduction)

Machine system production

Projects & Initiatives – PIXAPP

ficonTEC provides device micro-assembly and testing solutions for the photonics industry. These solutions are realized as cutting-edge, high-precision production systems utilizing advanced automation approaches, regardless of the device material and target application. Our modular system architecture is additionally scalable, so that exploratory, proof-of-process development as well as high-volume manufacturing requirements are addressable – and anything in between.

A globally installed base of 800 systems is already serving integrated photonics applications in telecom and datacom sectors, for 5G infrastructur, in 3D sensing for smartphone, automotive and aerospace applications, in high-power diode laser assembly, and in many others. ficonTEC is also actively involved in current international initiatives that are designed to reduce time-to-market for integrated photonics technology all within the current transition to high-volume manufacturing processes.

Discover Brilliant Solutions

The full gamut of process capability captured within a suite of innovative machine systems, all controlled by an advanced software interface

Manufacturing Platforms

Suitable for R&D, process development, complex stand-alone, as well as high-volume, multi-line in-line production

Flexible and scalable options already enable customized assembly and testing solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – both for contract manufacturing and for in-house R&D & production.

Entry-level systems

Stand-alone systems

In-line systems

Software Control

Controlled by our flexible process control software, our machines become much more than just the sum of their parts

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Process Control Master interface

Product Lines

Functional machine types designed to provide class-leading flexibility, performance and yield in photonic device production

ASSEMBLYLINE – Photonic Device Assembly

Fully automated, high-precision align-&-attach for (integrated) photonic and opto-electronic devices. Stand-alone and in-line. They uniquely combine fast-active alignment and flexible epoxy-based attachment configurations with a tried and tested software control interface.

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BONDLINE – Precision Die Bonding

Fully automated, precision die bonder cells focused on high-resolution passive positioning for photonic-enabled chips & dies, coupled with thermal attachment (position-&-attach. Accuracies down to the micron and even sub-micron range. Feature-rich functional modules provide thermal management, multiple bond force modes and eutectic/epoxy/soldering attachment capability.

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CUSTOMLINE – Flexible Micro-assembly Platform

Our most adaptable and versatile multi-purpose micro-assembly platform, providing fully automated align-&-attach for (integrated) opto-electronic and photonic devices. These systems are designed to provide highly flexible and individual solutions for a broad range of tasks in a wide range of industrial production environments.

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TESTLINE – Electro-optical Device Testing

Fully automated test-&-qualify systems providing electrical, optical and mixed-signal electro-optical chip and device testing – on or off-wafer – for laser chips, bars (stacks) and VCSELs. Full LIV testing as well as spectral and near/far-field beam characterization of single laser chips, VCSELs, unmounted laser diode bars, and chip-on-submount (CoS) sources. Also available for a variety of other complex tasks, including singulated chip testing, automated optical inspection, and more.

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Your Vision Expressed Via Our Process Capabilities

Our production systems embody the customer process,
described via a suite of our cutting-edge production capabilities

With 800 systems installed worldwide for diverse applications, only ficonTEC offers sufficient the breadth and depth of expertise

Assembly and testing remain the highest cost factors in photonic integrated circuit (PIC) production. To address this issue, international collaborations around the globe are actively researching new manufacturing concepts for PIC technology. The goal of these projects is to provide industry with an eco-system that will enable manufacturing to progress from the 1000s to the 100,000s and even millions, from single chip assembly to wafer-level approaches.

ficonTEC has consistently retained involvement in these initiatives in order to stay ahead of industry requirement. Add to this 20 years of development, continually working closely with the customer, and an invaluable modular approach to machine equipment design – all this uniquely places ficonTEC in a position to thoroughly describe your production requirements in terms of established process capabilities.

Challenge our applications development and process automation teams with your innovative products!


Technologies for production video


Photonic device assembly (align-&-attach)


Wafer level processing

Electro-optical testing (test-&-qualify)

What Is Photonics Assembly And Testing?

Photonic devices harness light as a tool for many important societal applications, including healthcare and communications. How are these devices assembled?

A brief introduction to an increasingly critical step in photonic device manufacturing

The alignment and bonding of opto-electronic chips and components, free-beam micro-optics and/or fiber-optic connections into finished photonic devices is commonly referred to as photonics assembly & test (some simply refer to this as packaging). Typical devices include telecom/datacom transceivers (TOSA/ROSA/BOSA), infrastructure devices for 5G networks, photonics-based (3D) sensors including those used in commercial, automotive and aerospace (LiDAR) systems, integrated PICs, high-power multi-emitter laser assemblies, micro-optical and optofluidic systems, integrated camera modules, fiber-coupled devices, and much more. Advanced automation of the assembly process steps requires multi-axis, sub-micron-accuracy component alignment (passive/active) and subsequent bonding using (UV-) epoxy compounds, thermal-based or laser-induced soldering and/or laser welding.

In particular, all manufacturing steps need to be compliant with stringent and often bespoke requirements for yield, process repeatability and performance reliability, while still enabling minimal process cycle time and minimum downtime. Finished devices also need testing and is required for simple devices such as laser diode chips and VCSELs, all the way up to the more complex devices noted above. Testing encompasses burn-in, LIV tests, beam and spectral characterization, as well as device design validation and performance verification.

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Recent News & Upcoming Events

ficonTEC blog entries, company news and product developments,
and where to find us at events around the globe