June 03, 2020 (updated June 04, 2021)
Combined Electro-optical Wafer-level Testing
More recent systems are increasingly mixed-signal e/o test, for example VLC Photonics, based in Valencia in Spain, have recently added a system to their capabilities and are now offering contract test services to their customer base.
To get a feel for the ‘simple’ wafer-level e/o test systems, this video should provide the viewer with a basic overview of the functionality. And staying with e/o test systems, ficonTEC is already starting to disseminate details of new batch/parallel (x16 – x64 device) testing for VCSELs & PIC channels, timed for release later in 2021. And last but not least, expect solutions for high-complexity devices (multi-mixed-channel) in the mid-term too. To find out more about all of these, you can view our Wafer-level Test Development Update webinar.
Related Webinar: Wafer-level Test Development Update
The new WaferLine Test product line continues to be rolled out to the first customers worldwide. Starting from the first concept systems delivered in 2019, this first of 3 WLT variants now commonly provides combined electro-optical test for R&D development and low-volume, low-complexity test-&-qualify tasks. However, on the very near-horizon are variants 2 and 3, for batch testing of VCSELs and test-&-qualify of high-complexity integrated devices (think: co-packaging), respectively. Join CEO Torsten Vahrenkamp for an update on what ficonTEC is bringing to the photonics test-&-measurement eco-system.