Automated Optical Inspection (AOI)
Facet inspection as well as contamination and defect recognition –
fast, automated and reliable
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully-automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools.
As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
Key Features
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High-magnification imaging system
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Color camera for individual color channel examination
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Köhler illumination
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Chip side wall inspection
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Die sorting
Facet inspection
Color camera for individual color channel examination
Reading data codes
Defect inspection (actor contamination)
Locate center of VCSEL
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Crack recognition
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Break-out detection
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Prognosis of crack propagation
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Particle recognition
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Dust and fiber recognition
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Detailed component/batch/lot tracking
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Individual error catalog handling
