Automated Optical Inspection (AOI)
Facet inspection as well as contamination and defect recognition – fast, automated and reliable
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools.
As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
Our defect recognition algorithms now use Deep Learning – see the video.
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Key Features
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High-magnification imaging system
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Color camera for individual color channel examination
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Köhler illumination
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Chip side wall inspection
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Die sorting

Facet inspection

Color camera for individual color channel examination

Reading data codes

Defect inspection (actor contamination)

Locate center of VCSEL
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Crack recognition
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Break-out detection
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Prognosis of crack propagation
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Particle recognition
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Dust and fiber recognition
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Detailed component/batch/lot tracking
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Individual error catalog handling