Automated Optical Inspection (AOI)
Facet inspection as well as contamination and defect recognition – fast, automated and reliable
No complex assembly process is complete without the ability to inspect and characterize the many different components used. ficonTEC’s fully automated INSPECTIONLINE systems acquire high-resolution pictures of the surfaces of interest and performs optical inspection based on the user’s criteria. For example, facet inspection of laser diodes, QC for coatings, surface inspection, top/bottom/side-wall inspection of semiconductor chips, and die sorting are just some of the many inspection tasks performed routinely by ficonTEC’s suite of inspection tools.
As for all of ficonTEC’s systems, a modular approach permits the inspection platform to equipped with additional features – automatic tray handling and various feeding philosophies, testing capabilities (e.g. LIV), top/bottom chip inspection, and in-situ labelling.
Our defect recognition algorithms now use Deep Learning – see the video.
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Key Features
High-magnification imaging system
Color camera for individual color channel examination
Köhler illumination
Chip side wall inspection
Die sorting
Facet inspection
Color camera for individual color channel examination
Reading data codes
Defect inspection (actor contamination)
Locate center of VCSEL
Crack recognition
Break-out detection
Prognosis of crack propagation
Particle recognition
Dust and fiber recognition
Detailed component/batch/lot tracking
Individual error catalog handling
