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The latest news and developments

ficonTEC news, press releases, product developments and corporate updates available here

Here we provide a list of the recent press releases, news items and other developments. For more details, simply follow the link, or for more product-related enquiries, simply get in touch via the details in the footer below.

December, 2018

Beckermus Technologies & ficonTEC to promote relationship

Beckermus Technologies Ltd. is the leading micro-assembly services provider in Israel. By utilizing ficonTEC photonics assembly and test machines as part of their manufacturing system toolkit, Beckermus supplies micro-electronics, micro-optics and photonic device assembly services to customers worldwide. As part of an on-going relationship together with ficonTEC, Beckermus recently purchased a CL1500 machine system equipped for active alignment. ficonTEC’s CustomLine products are a range of modular, multi-purpose assembly and test cells sporting the largest range of optional modules available to any ficonTEC platform. Both organizations have agreed to give the relationship more visibility, both publicly in print/online, as well as in presentations given at trade events and conferences. For further information on the services provided by Beckermus, visit www.beckermus.com.

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December, 2018

Further projects and collaborations for ficonTEC

ficonTEC continues to expand its involvement in international projects & initiatives dedicated to the development of photonic device manufacturing, making vital contributions to progress and at the same time helping ficonTEC to stay ahead of evolving industry manufacturing needs.

Firstly, CALADAN will demonstrate how integration of lasers and electronics onto a PIC can be done fully at the wafer-level using the established micro-transfer printing technique, thus eliminating this assembly bottleneck. GaAs quantum dot lasers and 130nm SiGe BiCMOS 56Gbaud-capable driver and receiver electronics will be transfer printed onto silicon photonic 300mm wafers. Starting from proven concepts in PIXAPP, a novel fast fiber attachment process will be demonstrated that reduces the time required for fiber attachment by an order of magnitude.

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Secondly, as part of the Disruptive Technologies Innovation Fund (DTIF) in Ireland, €4,1m has been given to support a physical Photonic Packaging Pilot Line designed to fill the gap that exists today, i.e. to fabricate tens to hundreds of units. The Photonic Packaging Pilot Line Hub will a) develop packaging designs tailored to fast cost-effective packaging processes and equipment and b) develop and install next generation packaging equipment (including test) with reduced cycle-times. This is just one of many of ficonTEC’s collaborations together with the Tyndall National Institute.

November, 2018

PIC Players Meeting

As part of the ‘Photonic Integration Week’ Event, to be held on January 14-15, 2019, in Valencia, Spain, Torsten Vahrenkamp, Owner/CEO at ficonTEC Service GmbH, will present the latest developments for assembly and test of integrated optics devices. PIW brings together experts around photonic integration technologies for tele/datacom, sensing and bio-technology applications, and 2019 will be it’s 3rd meeting.

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September, 2018

Product News

ficonTEC Service GmbH of Achim, Germany, has announced a comprehensive modernization of their product strategy. The new strategy allows ficonTEC to properly address increasing customer focus on in-line production line applications, while at the same time retaining continuity for existing customers, commitments and projects with current stand-alone machines. Read more

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August, 2018

ficonTEC sees Rapid Growth in Asia

With the global installation base hitting 500 machines only last summer, ficonTEC has now easily sailed past the 600 mark within the first half of 2018. A major contribution to this growth originates with demand in the Far East, in particular China: For Silicon Photonics assembly and testing applications, more than 20 fully-automatic systems have been delivered in 2018 alone, and in the same timeframe, the overall installation base within China has increased more than 50% over 2017. Lastly, in 2018 the first fully-automatic packaging production line was successfully installed.

To find out what ficonTEC can do for your photonics assembly application, come and talk to us at CIOE (www.cioe.cn, Booth #1A13-8), Sept. 5 – 8 in Shenzhen, PR China.

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April, 2018

Zukunftstag – Future Day 2018

ficonTEC actively support the training of young people. It is never too early to raise interest for technical job profiles. For instance through various events like the Future Day which took place last week. We again offered an interesting programme and provided a deep insight into our company. By participating into the Future Day more and more young people are gaining entry to the MINT disciplines. The future is now!

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February, 2018

PIC Awards Finalist

ficonTEC has been chosen as a finalist for the PIC Awards 2018. This award recognises advances in the development and application of key materials systems driving today’s photonic integrated circuits and providing a stepping stone to future devices. The PIC Awards will take place at PIC International conference on the 10th April 2018, Brussels.

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December, 2017

New ficonTEC Subsidiary

ficonTEC Eesti has expanded their staff count. As of the end of 2017 there are now seven employees based in the new office in Tallinn’s Tehnopol Center (in Estonia).

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December, 2017

VDMA/EMINT

ficonTEC becomes member of VDMA sector association EMINT

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December, 2017

ficonTEC contributes to PIXAPP pilot line

PIXAPP is the world’s first open-access Photonic Integrated Circuit (PIC) Assembly and Packaging Pilot line and helps users exploit the breakthrough advantages of PIC technologies. PIXAPP consists of a highly-interdisciplinary team of Europe’s leading industrial & research organizations and provides users with single-point access to PIC assembly and packaging. PIXAPP bridges the ‘valley of death’ often associated with moving from prototyping to low-volume fabrication, by giving companies an easy-access route to transferring R&D results to the market.

Within PIXAPP, ficonTEC develops a cross-platform beyond state-of-the-art PIC wafer and die level tester. The double-sided fiber alignment engine will be capable of performing ultrafast coupling and transmission measurements on a variety of platforms like, e.g., silicon on insulator, InP, and TripleX. In addition, a general and modular assembly concept will be developed on which all demonstrators within PIXAPP from telecom, Datacom, BioSensor as well as fiber Sensors can be assembled.

 

November, 2017

Supplier Award

ficonTEC has been honored with the 2017 Supplier Award from a leading global information and communication technologies solutions provider.

November, 2017

ficonTEC R&D Center

ficonTEC’s new R&D Center had its opening. Not far from ficonTEC’s Headquarters, the new R&D Center has expanded into new premises, thus allowing us to secure innovative product developments in cooperation with both customers and funded projects.

 

 

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May, 2017

EPIC workshop in Achim

ficonTEC successfully hosted an hosted EPIC workshop. The purpose of this workshop was to bring to together equipment manufacturers and SMEs to discuss the small- and medium-volume production of opto-electronic components, and to identify potential bottlenecks in process automation.

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May, 2017

ficonTEC: winner of Digitalisation Award

Digitalisation und Industry 4.0 are terms that are on everyone’s lips. However, their importance and the dimension of upcoming changes have not yet arrived in the minds of corporate management and in corporate practice. A digital strategy is the first step into the direction of digital transformation.

Opto-electronics has become one of the most important of these innovative driving forces.

ficonTEC won the ARTIE innovation award in the category ‘digitalisation’ during the ARTIE Expert Conference 2017 , and is proud of having been honored as a company with high innovative strength in the region. ARTIE is a regional network for technology, innovation and development. Read more

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March, 2017

Rewarding excellence, innovation and success within the photonic integrated circuit industry

ficonTEC has been chosen as a finalist for the PIC Awards 2017 by the PIC Awards governing committee in the category ‘Advances in Manufacturing’. The awards ceremony will take place at PIC International Conference on March 7, 2017, Brussels, Belgium.

2017

Trade shows

During the trade shows smt and Sensor + Test in Nuremberg, as well as Laser World of Photonics and Productronica in Munich, ficonTEC presented the latest trends to industry experts. The focus for all events was on demonstrating innovative developments and the latest applications. This was supported by a live machine demonstration, where interested visitors got the chance to take a peek at the complexity of the individual systems. More events

Various other events in USA, China, Israel and Sweden also offered our guests fascinating insights into the world of photonics.