HPLD Testing

LIV – High-power Laser Diode Testing

Testing and characterizing the light-generating devices
at the very heart of photonics technology

An important aspect of the development and manufacture of laser diodes is the so-called laser diode characterization, or Laser IV curve. By applying increasing current to the laser diode so it that emits light, the optical output is measured together with the voltage drop across the diode element. The resulting LIV curve reveals important clues about the quality of manufacture and the performance of the laser diode, enabling a pass/fail decision to be met.

To test if all functional components are meeting specifications, ficonTEC provides an automated test machine. The characteristic laser parameters are measured by running an LIV or, instead, a DC sweep. Parallel to the optical power, the optical output spectrum and near and far-field optical characteristics (amongst others) can also be measured.

solutions-platforms-hpld-testing-01
solutions-platformshpld-testing-05

The latest integrated designs, which incorporate both electronic and photonic devices on a hybrid device, provide benefit in terms of functionality, miniaturization, high-volume manufacture and cost/part. However, these high-volume manufactured devices also present a number of challenges during device testing, and require ever higher levels of automation as well as highly parallel, mixed-signal electro-optical testing concepts, both on and off-wafer – a goal to which ficonTEC is already working toward.

Key Features

  • LIV testing and beam characterization

  • Single emitter chip, or parallel testing of entire bars

  • Optical beam characteristics can be measured simultaneously with optical power output

  • All acquired and statistical data written to SQL database files

solutions-platformshpld-testing-04

High-power bar & CoS tester

technoligies-capabilities-technologies-testing-02

Measurement of optical beam characteristics

solutions-platforms-hpld-testing-02

Automatic pick-&-place of laser bars on GELpak

solutions-platforms-aoi-inspection-01

GELPak Full bar facet inspection

  • Vacuum pick-up tool handling

  • LIV, spectral and far & near-field tests

  • Fully automatic handling of devices

  • Easy-to-change optical & electrical probe heads

  • Option for component top side and facet inspection

  • Flexible integration of external test instrumentation and test protocols

  • Compatible to SQL and other database systems for data traceability

More information

Relevant systems include the those from the TESTLINE,
(some test capability is also available in ASSEMBLYLINE products)

solutions-platforms-machine-platforms-tl500

Test System TL500

technologies-capabilites-testing-2000

Opto-electronics Chip Tester TL2000

stand-alone-system

Automated Electro-optical Wafer-level Tester