High-power Laser Diode Assembly
Where would we be without laser diodes
and the myriad devices that are made with them?
The laser diode is one of the most common devices used throughout photonics. The micro-assembly process calls for the placement and bonding of single or multiple laser diodes (stacked or complete bars), the placement, active alignment and bonding of necessary micro-optical elements, subsequent device testing, and ultimately packaging and quality control.
ficonTEC’s machine systems are capable of all the steps necessary for assembling laser diodes, even high-power devices. Multiple in-line systems can be configured to address entire process segments.
Pick-&-Place and assembly of laser diodes as single emitters or as complete stack of laser diode bars
Bonding via eutectic soldering, epoxy adhesives, or laser-induced soldering
Placement, alignment and bonding of associated micro-optical components (fast-axis and slow-axis collimation)
Pigtailing of output fibers
LIV testing and beam characterization
Full packaging assembly
High-precision 6-DOF alignment engine
Automated attachment of collimator lenses
Configurable fast-active alignment routines
Closed-loop active alignment from beam profiling
Precision epoxy dispensing
Active tracking epoxy shrinkage compensation
Pick-&-place from component trays for extended operator-less production
Flexible, easy-to-use software platform