Laser Diode Assembly

Solutions & Platforms

High-power Laser Diode Assembly

Where would we be without laser diodes
and the myriad devices that are made with them?


The laser diode is one of the most common devices used throughout photonics. The micro-assembly process calls for the placement and bonding (align-&-attach) of single emitters, or multiple laser diodes (stacked or complete bars), the placement, active alignment and bonding of necessary micro-optical elements, subsequent device testing, and ultimately packaging and quality control.

ficonTEC’s machine systems are capable of all the steps necessary for assembling laser diodes, even high-power devices. Multiple in-line systems can be configured to address entire process segments.

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Key features

  • Pick-&-Place and assembly of laser diodes as single emitters or as complete stack of laser diode bars

  • Bonding via eutectic soldering, (UV) epoxy adhesives, or laser-induced soldering

  • Placement, alignment and bonding of associated micro-optical components (fast-axis and slow-axis collimation)

  • Pigtailing of output fibers

  • LIV testing and beam characterization

  • Full packaging assembly




Multiple element/emitter align-&-attach


Stacking of laser bars

  • High-precision 6-DOF alignment engine

  • High-precision multi-DOF alignment engine

  • Configurable fast-active alignment routines

  • Signal auto-locking

  • Closed-loop active alignment using beam profiling

  • Precision epoxy dispensing

  • Active tracking epoxy shrinkage compensation

  • Extended operator-less production

  • Flexible, easy-to-use software platform

More information

Relevant machine types:

Photonic Device Assembly (stand-alone), AL500


Fiber-Optic Assembly, incl. F300


Precision Die Bonder Cell (stand-alone), BL2000