Laser Diode Assembly

Solutions & Platforms

High-power Laser Diode Assembly

Where would we be without laser diodes
and the myriad devices that are made with them?

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The laser diode is one of the most common devices used throughout photonics. The micro-assembly process calls for the placement and bonding (align-&-attach) of single emitters, or multiple laser diodes (stacked or complete bars), the placement, active alignment and bonding of necessary micro-optical elements, subsequent device testing, and ultimately packaging and quality control.

ficonTEC’s machine systems are capable of all the steps necessary for assembling laser diodes, even high-power devices. Multiple in-line systems can be configured to address entire process segments.

Have special requirements? Speak to one of our team:

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Key features

  • Pick-&-Place and assembly of laser diodes as single emitters or as complete stack of laser diode bars

  • Bonding via eutectic soldering, (UV) epoxy adhesives, or laser-induced soldering

  • Placement, alignment and bonding of associated micro-optical components (fast-axis and slow-axis collimation)

  • Pigtailing of output fibers

  • LIV testing and beam characterization

  • Full packaging assembly

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Welding

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Multiple element/emitter align-&-attach

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Stacking of laser bars

  • High-precision 6-DOF alignment engine

  • High-precision multi-DOF alignment engine

  • Configurable fast-active alignment routines

  • Signal auto-locking

  • Closed-loop active alignment using beam profiling

  • Precision epoxy dispensing

  • Active tracking epoxy shrinkage compensation

  • Extended operator-less production

  • Flexible, easy-to-use software platform

More information

Relevant machine types:
ASSEMBLYLINE, FIBERLINE, BONDLINE, CUSTOMLINE

Photonic Device Assembly (stand-alone), AL500

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Fiber-Optic Assembly, incl. F300

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Precision Die Bonder Cell (stand-alone), BL2000