Mixed-signal electro-optical measurement instrumentation for integrated photonics
As optical and electrical technologies become more miniaturized, complex, and increasingly integrated with one another’s underlying architecture, the more inefficient and frustrating it is for process engineers to implement separate electrical and optical test and qualification procedures. To avoid this, engineers need fully automated systems that can perform complex precision alignment and assembly, as well as combined electro-optical I/O measurements for complex integrated photonic devices – from singulated dies, through to wafer-level and even up to fully packaged devices.
The good news is that the two organizations still continue to this day to work to support one another. Those with a keen eye may have seen Quantifi Photonics demos on the ficonTEC booth at 2023 events.
This collaboration is due to move up a gear in the coming months (2024), with continued mutual support at major events, for example at Photonics West and OFC in early 2024. In addition, there are long-term plans to better present the capabilities of the combined product portfolio both online and off.
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