Choose taskdie-level assembly & testfiber-level assembly & testwafer-level assembly & testcustom assemblylaser chip stacking/unstackinglaser weldingnot specified
Choose primary (select 1 – use 'Secondary' & 'Additional Notes' to add detail)micro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microwelding
Choose secondarymicro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microweldingnot specifiednone
Choose targetsensors/lidarcommunicationsquantum technologyhealthcareimage captureaerospace/spaceprintmacro/industrialmixed/variousnot specifiednone
Choose workflowR&Dprototypingproduct developmentprocess developmentbatch manufacturinghigh-volume, in-linenot specifiednone
Q1/2022Q2/2022Q3/2022Q4/2022Q1/2023Q2/2023Q3/2023Q4/2023not specifiednone
TelephoneEmailVideo Call
Yes, sign me up for ficonTEC's Webinar Series as well as for premium content, selected videos, etc.
Yes, please also sign me up for the Newsletter
Online searchWebsiteNewsletterOnline advertizingPrint advertizingTrade eventPrevious relationshipRecommendation
Data Privacy:
All request submissions and registrations are naturally subject to our comprehensive and GDPR-conform Privacy Policy. By clicking the "Send request" button, you are agreeing to being appropriately and reasonably contacted for the purposes of answering your request, and (if additionally selected) for receipt of our Newsletter and for topic dissemination, scheduling and participation for ficonTEC’s Webinar Series.
