Events

Upcoming events and exhibitions

Where to find us and view our solutions at international
events and exhibitions around the globe

Throughout the year and all over the world, ficonTEC exhibits at different trade shows, makes contributions at topical workshops, and presents at important technology conferences. Visitors to these events can take the opportunity to experience the demo systems on display, speak to our technical experts, and listen to the developments in the field of photonics micro-assembly and testing.

We look forward to meeting you there, introducing our company and individual products, and listening to your requirements.

CIOE

September 09 – 11, 2026
Shenzhen, China
Booth: 10C620 & 10C621

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ECOC

September 21 – 23, 2026
Malaga, Spain
Booth: 1225

AutoSens Europe

September 22 – 24, 2026
Barcelona, Spain
Booth: follows

EPIC – Tech Watch (ECOC)

September 23, 2026
Malaga, Spain
Presentation by Andon Bano

OPTICA – Global Economics Forum

September 24 – 25, 2026
Malaga, Spain
Presentation by Stefano Concezzi

imaps Symposium

September 28 – October 01, 2026
Boston, United States
Meet Stefano Concezzi on-site

Optics & Photonics

October 06 – 08, 2026
Norrköping, Sweden
Meet our sales team on-site

International Text Conference

October 11 – 16, 2026
San Antonio, United States
Keynote by André Lalonde

OCP Global Summit

October 12 – 15, 2026
San Jose, United States
Meet our sales team on-site

Semicon West

October 13 – 15, 2026
San Francisco, United States
Meet Stefano Concezz & André Lalonde on-site

OPTICA – PECC Summit

September 20 – 21, 2026
Sunnyvale, United States
Meet Rayhane Ghane on-site

PAINE

October 26 – 29, 2026
Phoenix, United States
Presentation by Rayhane Ghane

PIC Summit Europe

November 03 – 04, 2026
Eindhoven, Netherlands
Booth: follows

SW Test Asia

November 05 – 06, 2026
Eindhoven, Netherlands
Presentation by André Lalonde

EPIC Technology Meeting on Photonics & Microelectronics

November 09, 2026
Regensburg, Germany (AMS-OSRAM)
Meet Andon Bano on-site

AutoSens China

November 24- 26, 2026
Hefei, China
Booth: follows

COMNEXT

December 02- 04, 2026
Tokyo, Japan
Represented through NTT AT
Presentation by Torsten Vahrenkamp
Topic: Breaking the Manufacturing Bottleneck – Scalable Assembly and Test for LPO and CPO