Press Coverage

プレス報道

ficonTECの会社の歴史の中で重要なイベントはすべてオンラインで入手可能です

ここでは、過去数年間に遡る重要な報道のリストを英語で提供します。これらの項目は、ficonTECの成長と開発、及びコラボレーションとプロジェクトを強調しています。詳細は、リンクをたどるか、下のフッターに記載されている詳細から連絡をとることで取得できます。

2020

Article – Wafer Testing System at Southampton University’s Cornerstone bears first fruits for Silicon Photonics

Researchers have developed a new way to build power-efficient and programmable integrated switching units on a silicon photonics chip. The new technology is poised to reduce production costs by allowing a generic optical circuit to be fabricated in bulk and then later programmed for specific applications such as communications systems, LIDAR circuits or computing applications.

More information on the goals and achievements of the Silicon Photonics Group can be found online

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2020

Collaboration – Participation in the World Technology Mapping Forum, Berlin 2019

The goal of this international gathering was to update and discuss the first draft of Integrated Photonic Systems Roadmap – International (IPSR-I), looking ahead to global technology needs as far ahead as 2040. Head of Business Development Ignazio Piacentini took part in the forum and gave a presentation on ficonTEC’s R&D&I initiatives and prospects for the future.

More information on the goals and achievements of the fourm can be found online.

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2020

Article – Integrated Photonics: Hybrid integrated photonics cultivate a value chain

A German consortium develops a modular technology platform for integrated photonics, along with a supporting value chain. ficonTEC’s involvement includes a CustomLine assembly system for PolyPhotonics Berlin.

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2019

Article – Silicon photonics market growth depends on maturing processes and overcoming TAP challenges

An article written largely by experts from CEA-Leti, whose silicon photonics program has been working with numerous academic and industrial partners since from about 2005. The article looks at some of the remaining requirements in the silicon photonics eco-system, in particular those needed for adoption of wafer-level approaches in coupling and device characterization.

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2019

Interview – Auszeichnung mit Bestnote für Hanne Tydeks, ficonTEC R&D

Die Industrie- und Handelskammer Niedersachsen hat die 22-Jährige Hanne Tydeks bei einer Feierstunde in Oldenburg als eine der landesweit besten Auszubildenden in kaufmännischen und gewerblich-technischen Berufen geehrt.

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2019

Article – ficonTEC’s involvement in international R&D initiatives

Read about how ficonTEC’s involvement in international R&D initiatives will help contribute to reduced carbon emissions: ‘Researchers use photonics to develop low-emission 1.6 TB/s internet’

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2019

Article – Some of the challenges facing high-volume photonic device assembly

In this article, Andy Extance enquires about the many challenges that need to be overcomein order to provide quick and efficient (i.e. high-volume-capable) characterisation of PICs (photonic integrated circuits).

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2019

Article – EPIC interviews CEO of ficonTEC

In this article Jose Pozo, EPIC‘s CTO talks to Torsten Vahrenkamp, CEO of ficonTEC about the past, present and future of ficonTEC and the challenges for active alignment assembly of photonics systems.

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2019

Interview – Tyndall Institute, National Photonics Manufacturing Pilot Line

Tyndall National Institute in Cork is leading a new international consortium which will provide Europe with state-of-the-art photonics infrastructure. The value of the photonics market is expected to be worth over €615bn by 2020 and with Europe’s share of the production technology market currently at 55%, Tyndall’s new consortium PIXAPP will play a critical role in future economic development.

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2019

Article – High volume automated PIC assembly and testing

Photonics technology is undergoing a transition toward greater integration, with multiple functionality and components being combined onto a single chip or within a small hybrid assembly – also known as a photonic integrated circuit, or PIC.

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2018

Interview – SENSOR+TEST 2018

Are there any products that you are highlighting today? What makes your products unique in the marketplace? Which industries do your products serve?

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2016

Workshop – Integrated Photonics

Torsten Vahrenkamp, CEO, speaks at the OSA’s OIDA Workshop on Integrated Photonics High Volume Packaging, in Anaheim, CA/USA. The workshop takes place during OSA’s centenary year.

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2015

Project – Integrated Photonics Manufacturing

ficonTEC joins Integrated Photonics Manufacturing Innovation Hub consortium. Bridging the gap between applied research and product development, each hub brings together companies, universities, other academic and training institutions, and Federal agencies to co-invest in key emerging technology areas that can encourage investment and production.

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2014

Symposium – 1st Optical Interconnect in Data Centers

ficonTEC sponsors the 1st Optical Interconnect in Data Centers Symposium, which took place in Berlin in March 2014.

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2013

Awards – Accomplishments in Finance

Matthias Trinker, Chief Financial Officer of ficonTEC Service GmbH, has been recognized for showing dedication, leadership and excellence in finance.

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2010

Corporate – New headquarters

In a further expansion move designed to support the rapid growth, ficonTEC has moved into new headquarters. With an increased demand for solutions of automated photonic assembly projects, the company needed a more efficient and larger manufacturing space. The new facility offers a sufficient capacity to address the boost from the introduction of the company’s latest micro assembly platform

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2006

Aquisition – Acquired Newport Corporation

ficonTEC acquired Newport Corporation’s automated fiber alignment and laser welding product lines, in a move to complement the then fiber optic packaging process chain. Naturally, ficonTEC also took over pending and current customer account management.

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