ficonTEC’s collaboration with Tyndall operates on several levels.
Choose taskdie-level assembly & testfiber-level assembly & testwafer-level assembly & testcustom assemblylaser chip stacking/unstackinglaser weldingnot specified
Choose primary (select 1 – use 'Secondary' & 'Additional Notes' to add detail)micro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microwelding
Choose secondarymicro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microweldingnot specifiednone
Choose targetsensors/lidarcommunicationsquantum technologyhealthcareimage captureaerospace/spaceprintmacro/industrialmixed/variousnot specifiednone
Choose workflowR&Dprototypingproduct developmentprocess developmentbatch manufacturinghigh-volume, in-linenot specifiednone
Yes, sign me up for ficonTEC's Webinar Series as well as for premium content, selected videos, etc.
Yes, please also sign me up for the Newsletter
Online searchWebsiteNewsletterOnline advertizingPrint advertizingTrade eventPrevious relationshipRecommendation