ficonTEC’s collaboration with Tyndall operates on several levels.
Choose taskdie-level assembly & testfiber-level assembly & testwafer-level assembly & testcustom assemblylaser chip stacking/unstackinglaser weldingnot specified
Choose primary (select 1 – use 'Secondary' & 'Additional Notes' to add detail)micro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microwelding
Choose secondarymicro-optical assemblyfiber-optical assemblyintegrated photonics (PICs)die bondingdevice-level e/o testlarge-scale chip/wafer assemblywafer-level assemblywafer-level e/o testlaser chip stackingoptical inspectionlaser microweldingnot specifiednone
Choose targetsensors/lidarcommunicationsquantum technologyhealthcareimage captureaerospace/spaceprintmacro/industrialmixed/variousnot specifiednone
Choose workflowR&Dprototypingproduct developmentprocess developmentbatch manufacturinghigh-volume, in-linenot specifiednone
Q1/2022Q2/2022Q3/2022Q4/2022Q1/2023Q2/2023Q3/2023Q4/2023not specifiednone
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