Silicon Photonics Packaging
The recent technology of Silicon Photonics (SiPh) impressively shows the evolution the optics market is undergoing for a while now. From bulky components to micro-optical components to integrated optics the photonic sector experiences what became true for the electronics market decades ago. The miniaturization and integration is essential for the capability of state-of-the-art products.
As the component density of optical modules and within their complexity increases the need for automating the packaging of photonic packages becomes more and more obvious. Furthermore the hybrid integration with semi-conductor electronics -a highly automated technology- can only keep up with the growing demand when being automated.
ficonTEC’s leading solution for Silicon Photonics assembly tasks is the FL300 fiber optic AutoAlign system.
ficonTEC offers automation equipment for photonic packaging. The portfolio consists of semi-automatic to fully automatic die bonders and testers. The micro-optics and Silicon Photonics markets are served with standard and individual machines by a dedicated and extremely experienced team.