Laser Diode Assembly

Solutions & Platforms

LIV – High-power Laser Diode Assembly

The laser diode is one of the most common devices used throughout photonics. The micro-assembly process calls for the placement and bonding of single or multiple laser diodes (stacked or complete bars), the placement, active alignment and bonding of necessary micro-optical components, device testing, and ultimately packaging and quality control.

ficonTEC’s machines and modules are capable of all the steps necessary for assembling laser diodes, even high-power devices.

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Key features

  • Pick-&-Place and assembly of laser diodes as single emitters or as complete stack of laser diode bars

  • Bonding via eutectic soldering, epoxy adhesives, or laser-induced soldering

  • Placement, alignment and bonding of associated micro-optical components (fast-axis and slow-axis collimation)

  • Pig-tailing of output fibers

  • LIV testing and beam characterization

  • Full packaging assembly

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Bonding

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Single emitter assembly

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Stacking of bars and assembly of single emitters

  • High-precision 6-DOF alignment engine

  • Automatically attachment of fast axis collimator lenses

  • Fast configurable active alignment routines

  • Signal auto-locking

  • Closed loop active alignment from beam profiling

  • Precision epoxy dispensing

  • Active tracking epoxy shrinkage compensation

  • Pick & Place from component trays for extend full automation

  • Flexible, easy-to-use software platform

More information

Relevant machine platforms and modules include the
TL & FL product lines, for example:

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AL500-FAC for Fast-axis Collimator Assembly

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FL300 for Fiber-optics Assembly

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BL2000 for Automated Die Bonding