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ficonTEC launches next-generation optical circuit switching and the ai era
Product News
ficonTEC launches next-generation optical circuit switching and the ai era
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ficonTEC launches DLT-D1, a multi-site die-level tester for double-sided compact 3D CPO optical engines
Product News
ficonTEC launches DLT-D1, a multi-site die-level tester for double-sided compact 3D CPO optical engines
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SENKO, BizLink and ficonTEC partner at SEMICON Taiwan 2025 to pioneer advanced ect manufacturing
Business News
SENKO, BizLink and ficonTEC partner at SEMICON Taiwan 2025
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VLC Photonics and ficonTEC Showcase Advanced Automated Die-Level Testing and Assembly at Laser World of Photonics in Munich
Business News
VLC Photonics and ficonTEC Showcase Advanced Automated Die-Level Testing and Assembly at Laser World of Photonics in…
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ficonTEC Introduces Industry’s First, ATE Agnostic, Top-Sided Electro-optical Wafer-level Tester
Product News
ficonTEC Introduces Industry’s First, ATE Agnostic, Top-Sided Electro-optical Wafer-level Tester
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ficonTEC releases innovative wafer-level test cell to complement existing ATE
Product News
ficonTEC releases innovative wafer-level test cell to complement existing ATE
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Advancing Photonics for Next-Generation Medical Technologies
PhotonMed
Photonics-based medical devices to revolutionize healthcare
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OFC 2024 sets stage for the important role of integrated photonic assembly, packaging and test solutions
Business/Corporate News
OFC 2024 celebrates unprecedented visitor and exhibitor numbers
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Photonics West 2024 reaffirms ficonTEC’s technical roadmap
Business/Corporate News
Photonics West 2024 reaffirms ficonTEC’s technical roadmap
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Mass manufacturing of transceivers for the terabit/s era – an update
Mass manufacturing
MASSTART – a holistic transformation to assembly and characterization