Photonics automated assembly and testing
From Lab to Fab
ficonTEC provides automated micro-assembly and testing solutions for the photonics industry. These solutions are cutting-edge and are independent of the device material and of the specific application the device is targeting. Additionally, our modular system architecture is scalable from early device development environments, over new product introduction (NPI) and all the way up to high-volume requirements.
A globally installed base of over 500 systems is already serving integrated photonics applications in telecom and datacom sectors, in sensing applications ranging from biomedical to automotive, in high-power diode laser assembly, and much more.
Not resting with the status quo, ficonTEC is also actively involved in several internationally-supported initiatives that promote access to integrated photonics technology through the transition to high-volume manufacturing processes via advanced automation for both singulated dies as well as wafer-level approaches.
Solutions & Capabilities
Automated high-precision micro-assembly and testing of
photonic and opto-electronic components and sub-systems
Welcome to ficonTEC
NPI (New Product Introduction)
By actively engaging in international photonics integration initiatives,
we stay ahead of current technologies and fulfil the requirements of industry
Assembly, packaging and testing remain the highest cost factors in photonic integrated circuit (PIC) production. To address this issue, international collaborations around the globe are actively researching new manufacturing concepts for PIC technology. The goal of these projects is to provide industry with the production processes and the standards that will enable manufacturing to progress from the 1000s to the 100s of thousands and millions, from single chip assembly to wafer-level approaches, and where cost/part is the measure for equipment amortization rather than initial capital outlay.
ficonTEC has consistently retained a unique modular approach to its machine equipment design. Flexible and scalable options already enable customized assembly, packaging and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume production facilities – both for contract manufacturing and for in-house R&D and production.
What is photonics assembly and testing?
Photonics devices enable light to be used in manufacturing,
for sensing and for communications. How are these devices assembled?
The alignment and bonding (assembly) of opto-electronic components, free-beam optics and/or fiber-optic pig-tailing into finished photonics devices is commonly referred to as photonics packaging. Typical devices include telecom/datacom transceivers and TOSA/ROSA, stacked laser diode bars and high-power multi-emitter assemblies, micro-optics, optofluidic systems, camera modules, fiber-coupled devices, photonics-based sensors, automotive LIDAR, and much more.
Automating the assembly process steps requires multi-axis, sub-micron accuracy component alignment (passive/active) and subsequent bonding using epoxy compounds, laser-induced soldering and/or laser welding. In particular, in line with standard manufacturing practices, all assembly steps need to be compliant with stringent requirements for yield, process repeatability and performance reliability, while still providing minimal process cycle time.
Devices also require testing. Testing encompasses burn-in, LIV tests, characterization, validation, verification and mass production ‘go’ / ’no go’ testing from early prototyping (with multi-project wafers, MPW) to mass market production. It is required for simple devices such as laser diode chips and VCSELS, all the way up to complex photonics transceivers, compact camera modules (CCM), sensors, and other opto-electronics.
Why ‘From Lab to Fab’? An increasingly important aspect in manufacturing is the current trend from singulated chips to full wafer-level approaches. This transition for photonics component manufacturing is much as was the case for the integrated micro-electronics industry in the 1970’s.
Currently, system approaches and materials R&D initiatives still require flexible, automation-capable micro-assembly machines for low-volume testing of device concepts and packaging approaches. However, the proposed wafer-level manufacturing and testing schemes for high-volume ‘fab-type’ photonics applications require development of highly-automated packaging and assembly equipment.
Requirements for process automation of optical interconnect technologies
The book discusses developments in optical materials and components (such as single and multi-mode waveguides), circuit boards and ways the technology can be deployed in data centres – Woodhead Publishing 2016.
Chapter 14 “Requirements for process automation of optical interconnect technologies” is written by Ignazio Piacentini (Director of Business Development) and Torsten Vahrenkamp, CEO – ficonTEC Germany.Read chapter